2019
DOI: 10.1088/2053-1591/ab600e
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Comparing metal oxide thin films as transparent p-type conductive electrodes

Abstract: The development of transparent and p-type conductive layers remains a challenge to achieve more efficient hole collection and to combine with the most common n-type counterparts into transparent p-n junctions. Here, several candidates based on abundant materials: Cu 2 O, NiO and SnO have been prepared, characterized and comparatively evaluated. Thin-film deposition methods (evaporation and sputtering) have been used along with thermal treatments (oxidation and sulfurization) to maximize the transmittance and c… Show more

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Cited by 11 publications
(11 citation statements)
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“…The average crystalline sizes are estimated by Scherrer’s equation . The introduction of Al 2 O 3 yields a bigger crystallite size (∼4.63 nm) than that on bare p -Si (∼3.18 nm), which may contribute to a better conductivity because of the reduced grain boundary scattering. …”
Section: Resultsmentioning
confidence: 99%
“…The average crystalline sizes are estimated by Scherrer’s equation . The introduction of Al 2 O 3 yields a bigger crystallite size (∼4.63 nm) than that on bare p -Si (∼3.18 nm), which may contribute to a better conductivity because of the reduced grain boundary scattering. …”
Section: Resultsmentioning
confidence: 99%
“…They reported TCOs with conductivities of up to 1.7 × 10 −2 S/cm and average transmittances of about 70%. 46,47 In this work, we follow a strategy similar to those reported by Fortunato 44,45 and Guilleń. 46,47 We used DC sputtering to grow ultra-pure copper thin films (99.9995%, known as 5N5) on the surface of fused silica and corning glass substrates.…”
Section: Introductionmentioning
confidence: 99%
“…46,47 In this work, we follow a strategy similar to those reported by Fortunato 44,45 and Guilleń. 46,47 We used DC sputtering to grow ultra-pure copper thin films (99.9995%, known as 5N5) on the surface of fused silica and corning glass substrates. Subsequently, we carried out two postdeposition thermal treatments to oxidize the thin copper films in a controlled manner.…”
Section: Introductionmentioning
confidence: 99%
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“…Reactive sputtering methods are proven effective in obtaining NiO thin films with acceptor defects controlled by the oxygen partial pressure. [ 13,24,25 ] For this work, NiO thin films were deposited on unheated glass substrates by reactive DC sputtering, changing the oxygen‐to‐argon partial pressure ratio ( O pp ) over a wide range. The structural, morphological, optical and electrical properties of the sputtered films are comparatively analyzed as a function of the O pp , both as‐grown and after heating in air at 400 °C.…”
Section: Introductionmentioning
confidence: 99%