“…Ultrasonic cleaning has been used in various engineering fields, such as semiconductor manufacturing [33] , [34] , [35] , [36] , and the mechanisms have been extensively investigated. In an ultrasonic field with sufficient acoustic pressure, cavitation bubbles can be generated by stretching of the liquid during the rarefaction phase of sound waves [37] , [38] . A cavitation bubble will exhibit dynamic motion in response to the acoustic waves, and this induces microscale flows around the bubble, including vortical flows and high-speed jets, which are responsible for the ultrasonic cleaning effect [39] , [40] , [41] , [42] .…”