2022 23rd International Conference on Electronic Packaging Technology (ICEPT) 2022
DOI: 10.1109/icept56209.2022.9873117
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Comparative Thermal and Thermomechanical Analyses of Traditional and Flip Chip Double-Sided Cooling Power Module

Guoliao Sun
1
,
Cheng Peng
2
,
Hua-Peng Chen
3
et al.
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