Comparative study on copper leaching from waste printed circuit boards by typical ionic liquid acids

Chen, Mengjun; Huang, Jinxiu; Ogunseitan, Oladele A.; Zhu, Nengming; Wang, Yanmin

doi:10.1016/j.wasman.2015.03.037

Cited by 107 publications

(31 citation statements)

References 34 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…S.no. S11 S12 S13 S14 S15 S16 S17 S18 S19 S20 Mean reason behind its abundance in the basic phones (Chen et al, 2015). Aluminum and nickel are mostly used in the welding and in the cover case of the screen which provides strong internal support in the mobile phone.…”

Section: Tablementioning

confidence: 99%

Toxicity trends in E-Waste: A comparative analysis of metals in discarded mobile phones

Singh

Duan

Ogunseitan

et al. 2019

Journal of Hazardous Materials

Self Cite

View full text Add to dashboard Cite

Mobile phones and various electronic products contribute to the world's fastest-growing category of hazardous waste with international repercussions. We investigated the trends in potential human health impacts and ecotoxicity of waste mobile phones through quantitative life cycle impact assessment (LCIA) methods and regulatory total threshold limit concentrations. A market-dominant sample of waste basic phones and smartphones manufactured between 2001 and 2015, were analyzed for toxicity trends based on 19 chemicals. The results of the LCIA (using USEtox model) show an increase in the relative mass of toxic materials over the 15year period. We found no significant changes in the use of toxic components in basic phones, whereas smartphones contained a statistically significant increase in the content of toxic materials from 2006 to 2015. Nickel contributed the largest risk for carcinogens in mobile phones, but the contributions of lead and beryllium were also notable. Silver, zinc and copper contents were associated with non-cancer health risks. Copper components at 45,818-77,938 PAF m 3 /kg dominated ecotoxicity risks in mobile phones. Overall, these results highlight the increasing importance of monitoring trends in materials use for electronic product manufacturing and electronicwaste management processes that should prevent human and environmental exposures to toxic components.

show abstract

Section: Tablementioning

confidence: 99%

Toxicity trends in E-Waste: A comparative analysis of metals in discarded mobile phones

Singh

Duan

Ogunseitan

et al. 2019

Journal of Hazardous Materials

Self Cite

View full text Add to dashboard Cite

show abstract

“…Many researchers have reported the Cu leaching from waste printed circuit boards using various lixiviants. Inorganic acids, organic acids, ionic liquids, and even microbes (such as bacteria and fungi) have been proposed for the solubilization of Cu from the printed circuit boards [12][13][14][15][16][17][18][19]. Even though Fe(III) salts were found to be a good leachant of Cu from other different minerals [20][21][22], only Yazici and Deveci [23] reported the effect of Fe(III) salts on Cu leaching from PCBs.…”

Section: Introductionmentioning

confidence: 99%

Leaching and Selective Recovery of Cu from Printed Circuit Boards

Sethurajan

Hullebusch

2019

Metals

View full text Add to dashboard Cite

Printed circuit boards (PCBs), a typical end-of-life electronic waste, were collected from an E-waste recycling company located in the Netherlands. Cu and precious metal concentration analyses of the powdered PCBs confirm that the PCBs are multimetallic in nature, rich, but contain high concentrations of Cu, Au, Ag, Pd, and Pt. Ferric sulfate concentration (100 mM), agitation speed (300 rpm), temperature (20 °C), and solid-to-liquid ratio (10 g·L−1) were found to be the optimum conditions for the maximum leaching of Cu from PCBs. The ferric sulfate leachates were further examined for selective recovery of Cu as copper sulfides. The important process variables of sulfide precipitation, such as lixiviant concentration and sulfide dosage were investigated and optimized 100 ppm of ferric sulfate and (copper:sulfide) 1:3 molar ratio, respectively. Over 95% of the dissolved Cu (from the multimetallic leachates) was selectively precipitated as copper sulfide under optimum conditions. The characterization of the copper sulfide precipitates by SEM-EDS analyses showed that the precipitates mainly consist of Cu and S. PCBs can thus be seen as a potential secondary resource for copper.

show abstract

“…Hence, this method is expected to replace gold extraction by cyaniding. A key issue is how to efficiently recover the ionic gold in the leachate, but there has been little research carried out on the recovery of gold from iodine leaching solution up until now, with major recovery methods including zinc dust precipitation [3], activated carbon adsorption [4], ion exchange [5], solvent extraction [6], and the electrodeposition method [7]. The electrodeposition method is advantageous in its easy operation, low recovery cost, good selectivity, and high recovery rate.…”

Section: Introductionmentioning

confidence: 99%

A Study of the Electrodeposition of Gold Process in Iodine Leaching Solution

Meng

et al. 2019

Metals

View full text Add to dashboard Cite

This paper mainly discusses electrodeposition of gold from iodine leaching solution through single-factor testing and explores the influence of gold concentration in catholyte, mass fraction of iodine in anolyte, anolyte n(I2):n(I−), cell voltage, and electrolysis time on the percentage of gold deposition and coulombic efficiency. Moreover, a response surface methodology was adopted to study interactions among variables and influence on the percentage of gold deposition, with mass fraction of iodine in anolyte, anolyte n(I2):n(I−), and cell voltage as variable factors and percentage of gold deposition as the response value. The electrodeposition process was fitted via pseudo first-order kinetics and pseudo second-order kinetics. Finally, the free surface morphology of gold deposited on the cathode plate was observed by scanning electron microscope. Given the results, a principal effect relationship can be concluded between mass fraction of iodine in anolyte, anolyte n(I2):n(I−), cell voltage, and percentage of gold deposition, with cell voltage > anolyte n(I2):n(I−) > mass fraction of iodine in anolyte and a second-order regression equation obtained with percentage of gold deposition as the response value. The optimized process conditions were gold concentration in catholyte 20 mg/L, mass fraction of iodine in anolyte 0.59%, anolyte n(I2):n(I−) is 1:7.5, cell voltage 12.9 V, and electrolysis time 2 h. The average percentage of gold deposition of three confirmatory experiments was 96.43%, a figure very close to the predicted value of the model 97.76%, which proves that the quadratic polynomial model obtained by response surface methodology optimization is feasible and that the electrodeposition of gold process conforms to a pseudo second-order kinetic model. Au can be attached well to the cathode plate and the deposition layer is formed by granular grain accumulation.

show abstract

Comparative study on copper leaching from waste printed circuit boards by typical ionic liquid acids

Cited by 107 publications

References 34 publications

Toxicity trends in E-Waste: A comparative analysis of metals in discarded mobile phones

Toxicity trends in E-Waste: A comparative analysis of metals in discarded mobile phones

Leaching and Selective Recovery of Cu from Printed Circuit Boards

A Study of the Electrodeposition of Gold Process in Iodine Leaching Solution

Contact Info

Product

Resources

About