Comparative study of the heating surface impact on porous-material-involved spray system for electronic cooling – an experimental approach

Journal of Electronic Packaging

Jiang

2021

The rapid development of electronics, energy and propulsion systems has led us to the point where their performances are limited by cooling capacities. Heat fluxes of 10~100, even over 1,000 W/cm2 need to be dissipated with minimum coolant flow rate in next-generation power electronics. Spray cooling is a high heat flux, uniform and efficient cooling technique proven effective in various applications. However, its cooling capacity and efficiency need to be further improved to meet next-generation ultrahigh-power applications. Engineering of surface properties and structures can fundamentally affect the liquid-wall interactions, thus becoming the most promising way to enhance spray cooling. However, the unclear mechanisms of surface-enhanced spray cooling cause lack of guiding principles for surface design. Here, progress in spray cooling on surfaces with structures of different scales are reviewed and their performances evaluated and compared. Spray cooling can achieve critical heat flux (CHF) above 945 W/cm2 and heat transfer coefficient (HTC) up to 57 W/cm2K on structured surfaces for pressurized nozzle and CHF and HTC up to 1250 W/cm2 and 250 W/cm2K, respectively, on a smooth surface with the assistance of secondary gas flow. CHF enhancement of 110% was achieved on hybrid micro- and nanostructured surfaces. A clear map of enhancement mechanisms is proposed after analysis. Some future concerns are also proposed. This work helps the understanding and design of engineered surfaces in spray cooling and provides insights for interdisciplinary applications of heat transfer and advanced engineering materials.

Section: Introductionmentioning

confidence: 99%

Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms

Journal of Electronic Packaging

Jiang

2021

“…Generally, it will increase with the increase of SHX efficiency and vary with the ambient temperature. Secondly, the cooling ability and exergy penalty rate of SHX can be estimated by Equations (32) and (37), corresponding results under Cases 11~15 are shown as Figure 12b,c. Generally, the cooling ability of SHX which is inversely proportional to the skin temperature will increase with the increase of SHX efficiency.…”

Section: Skin Hxsmentioning

confidence: 99%

“…Besides, several advanced heat transfer methods of TMS have also been proposed. Wang et al [35][36][37] investigated the flash boiling spray cooling under the high altitude condition (low ambient pressure), which shows excellent heat dissipation ability for extreme heat flux devices. Deng [38] and Ma [39] have investigated the mini-channel heat sink numerically and experimentally, showing good performance for the application in the cooling of high heat flux microelectronic devices.…”

Section: Introductionmentioning

confidence: 99%

Cooling Ability/Capacity and Exergy Penalty Analysis of Each Heat Sink of Modern Supersonic Aircraft

Mao

et al. 2019

Entropy

Self Cite

The aerospace-based heat sink is defined as a substance used for dissipating heat generated by onboard heat loads. They are becoming increasingly scarce in the thermal management system (TMS) of advanced aircraft, especially for supersonic aircraft. In the modern aircraft there are many types of heat sinks whose cooling abilities and performance penalties are usually obviously different from each other. Besides, the cooling ability and performance penalty of a single heat sink is even different under different flight conditions—flight altitude, Mach number, etc. In this study, the typical heat sinks which are the fuel mass, ram air, engine fan air, skin heat exchanger, and expendable heat sink will be studied. Their cooling abilities/capacities, and exergy penalties under different flight conditions have been systematically estimated and compared with each other. The exergy penalty presented in this paper refers to the exergy loss of aircraft caused by the extra weight, drag and energy extraction of various heat sinks. The estimation models, as well as the results and discussion have been elaborated in this paper, which can be can be used to further optimize the TMS of modern advanced aircraft, for example, the layout design of various heat sinks and the improvement the control algorithm.

“…To achieve the dynamic cooling ability regulation of different locations of the CP, a thermoelectric heat pump (THP) and a high-heat-conductivity cover plate are employed in this study. Due to the small size, fast cooling speed, no environment pollution, and control simplicity, THPs have been extensively used in the temperature management system [25][26][27]. Traditionally, the cold side of the THP is attached to the cooling object and the hot side of THP the heat sink, which means that the cold-side temperature is usually the only variable can be controlled.…”

Section: Introductionmentioning

confidence: 99%

A Thermoelectric-Heat-Pump Employed Active Control Strategy for the Dynamic Cooling Ability Distribution of Liquid Cooling System for the Space Station’s Main Power-Cell-Arrays

et al. 2019

Entropy

Self Cite

A proper operating temperature range and an acceptable temperature uniformity are extremely essential for the efficient and safe operation of the Li-ion battery array, which is an important power source of space stations. The single-phase fluid loop is one of the effective approaches for the thermal management of the battery. Due to the limitation that once the structure of the cold plate (CP) is determined, it is difficult to adjust the cooling ability of different locations of the CP dynamically, this may lead to a large temperature difference of the battery array that is attached to the different locations of the CP. This paper presents a micro-channel CP integrated with a thermoelectric heat pump (THP) in order to achieve the dynamic adjustment of the cooling ability of different locations of the CP. The THP functions to balance the heat transfer within the CP, which transports the heat of the high-temperature region to the low-temperature region by regulating the THP current, where a better temperature uniformity of the CP can be achieved. A lumped-parameter model for the proposed system is established to examine the effects of the thermal load and electric current on the dynamic thermal characteristics. In addition, three different thermal control algorithms (basic PID, fuzzy-PID, and BP-PID) are explored to examine the CP’s temperature uniformity performance by adapting the electric current of the THP. The results demonstrate that the temperature difference of the focused CP can be declined by 1.8 K with the assistance of the THP. The proposed fuzzy-PID controller and BP-PID controller present much better performances than that provided by the basic PID controller in terms of overshoot, response time, and steady state error. Such an innovative arrangement will enhance the CP’s dynamic cooling ability distribution effectively, and thus improve the temperature uniformity and operating reliability of the Li-ion space battery array further.