Comparative Performance of a Copper Sulphamate Bath with Conventional Acid-Sulphate and Cyanide Baths

Kokila, Preethi H.; Sarma, R. Lekshmana; Sriveeraraghavan, S.

doi:10.1080/00202967.2001.11871399

Cited by 1 publication

(2 citation statements)

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“…However, since the huge fundamental aspects of the ionic liquid in the electrodeposition, which is a wide emerging field capable of fabricating nanoscale materials having application in nanoelectronics and nanocatalysts, electrodeposition of metals or alloys from ionic liquid is being viewed as a versatile technique because of operable processes at room temperature . Extensive exploration of copper‐tin electrodeposition has been done by many authors in numerous traditional systems such as fluoroborate, methane sulphonate, sulfates and pyrophosphate‐based electrolytes . Recently, Ming et al.…”

Section: Introductionmentioning

confidence: 99%

“…[14][15][16][17][18] Extensive exploration of copper-tin electrodeposition has been done by many authors in numerous traditional systems such as fluoroborate, methane sulphonate, sulfates and pyrophosphate-based electrolytes. [19][20][21][22][23] Recently, Ming et al prepared copper-tin alloy coating in 1-butyl-3-methylimidazolium chloride ([C4mim][Cl]) using cathodic electrodeposition. [24] Endres et al electrodeposited Cu-Zn and Zn-Sn films as well as free-standing nanowires from ionic liquids triflouromethanesulphonate based ionic liquid.…”

Section: Introductionmentioning

confidence: 99%

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Electrochemical Fabrication of Copper and Tin Micro‐Crystals from a Protic Ionic Liquid Medium

Bhujbal¹,

Rout

Venkatesan

et al. 2020

ChemistrySelect

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New protic ionic liquid, namely 1‐Methylpiperidinium trifluoromethane sulphonate [HmPip][OTf] was synthesized and employed for the dissolution of Cu and Sn metal precursors followed by the electrodeposition process of the subsequent metals. The cyclic voltammogram of [HmPip][OTf], CuCl2 (80 mM) in [HmPip][OTf] and SnCl2 (65 mM) in [HmPip][OTf] phase recorded at glassy carbon electrode (working electrode), with the glassy carbon as counter and platinum as the reference electrode. The CV indicates that Cu2+ underwent two‐step one‐electron transfer, whereas Sn2+ reduced via one step two‐electron transfer. The diffusion coefficient of Cu1+, Cu2+ and Sn2+ ions in [HmPip][OTf] phase were evaluated by the CV method. The experimental temperature and the scan rate were set at 353 K and 110 mV/s respectively. Electrodeposition of Cu and Sn was done at their corresponding reduction potential determined from cyclic voltammetry. Spectroscopic investigation of the deposits obtained after electrodeposition is done by SEM‐EDX as well as XRD.

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Section: Introductionmentioning

confidence: 99%