2021
DOI: 10.1109/access.2021.3107537
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Compact TSV-Based Hairpin Bandpass Filter for Thz Applications

Abstract: A hairpin bandpass filter with compact feeder structure is proposed for terahertz (THz) applications by using the model of odd-even propagation mode. By employing the three-dimensional integrated through-silicon via (TSV) technology, the proposed filter exhibits an ultra-compact size of only 0.24 × 0.028 mm 2 (1.38 × 0.16 λg 2 ). The model of the proposed filter is established and optimized with the HFSS tool based on finite element method. The results of S-parameters reveal that the proposed filter with cente… Show more

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Cited by 4 publications
(2 citation statements)
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References 30 publications
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“…Indeed, some passive devices based on TSV have been proposed [3,11]. Recently, due to the large-scale expansion of semiconductor technology and emerging markets such as automotive radar and 5G, TSV technology has been gradually extended to MMW and THz fields [12][13][14]. In 2022, a silicon substrate integrated gap waveguide (SSIGW) utilizing TSV was proposed to address the aforementioned issues, and it has been successfully applied in the design of a 6G filtering metalens antenna [15].…”
Section: Introductionmentioning
confidence: 99%
“…Indeed, some passive devices based on TSV have been proposed [3,11]. Recently, due to the large-scale expansion of semiconductor technology and emerging markets such as automotive radar and 5G, TSV technology has been gradually extended to MMW and THz fields [12][13][14]. In 2022, a silicon substrate integrated gap waveguide (SSIGW) utilizing TSV was proposed to address the aforementioned issues, and it has been successfully applied in the design of a 6G filtering metalens antenna [15].…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, there is also much literature based on advanced high-precision semiconductor technologies, such as deep reactive ion etching (DRIE) [9,10], silicon via (TSV) [11,12], and microelectromechanical systems (MEMS) [13][14][15][16][17], to achieve the manufacturing of terahertz filters. Ideally, with the improvement of fabrication accuracy, performance errors can be reduced to a lower level, but due to the maturity of advanced semiconductor technology and material limitations, the current performance of terahertz devices is not excellent.…”
Section: Introductionmentioning
confidence: 99%