Smart Photonic and Optoelectronic Integrated Circuits XXII 2020
DOI: 10.1117/12.2546449
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Compact silicon photonics-based laser modules for FM-CW LIDAR and RFOG

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Cited by 3 publications
(4 citation statements)
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“…The high-level schematic of the multi-frequency laser source (MFLS) is shown in Figure 1 and consists of all the optical components before the two optical circulators (see [13] for detailed architecture including SiP chip). The optical power at 1550 nm is provided by three distributed feedback (DFB) semiconductor lasers, a master laser and two slave lasers, developed by TeraXion in collaboration with the National Research Council of Canada (NRC).…”
Section: Multi-frequency Laser Source 21 Architecturementioning
confidence: 99%
See 1 more Smart Citation
“…The high-level schematic of the multi-frequency laser source (MFLS) is shown in Figure 1 and consists of all the optical components before the two optical circulators (see [13] for detailed architecture including SiP chip). The optical power at 1550 nm is provided by three distributed feedback (DFB) semiconductor lasers, a master laser and two slave lasers, developed by TeraXion in collaboration with the National Research Council of Canada (NRC).…”
Section: Multi-frequency Laser Source 21 Architecturementioning
confidence: 99%
“…We present progress towards compact RFOGs using phase locked diode lasers and miniaturized optics on a silicon optical bench (SiOB). Further integration was realized by encapsulating unpackaged semiconductor lasers on a common substrate with a silicon photonics (SiP) chip comprising active and passive components [11]- [13]. Other than a reduction in size, this allowed a sizable increase in the bandwidth of the OPLL loops by shortening optical and electrical paths.…”
Section: Introductionmentioning
confidence: 99%
“…A small laser or other optical components are linked to the chip to create a complete system that is then connected to an electrical pin and soldered to a PCB [ 53 , 54 , 55 ]. This kind is different from the packaging for the numerous application cases outlined in the preceding section [ 56 ]. Figure 13 depicts an integrated package form of a femtosecond laser [ 57 ], with a silicon photonic chip on the left connected to 12 multicore fibers through 84 connecting channels in the center, while glass serves as the intermediary layer.…”
Section: Application Of Sip Technologymentioning
confidence: 99%
“…Within the Broadcom portfolio, for example, are integrated solutions covering up to 80% of the needed components including emitters, sensors, encoders, high speed optical data links, Ethernet physical layers (PHYs), and Micro Optics (Figure 1). The emerging silicon photonics technologies also offer a path toward miniaturization, which could be exploited to incorporate LIDAR systems into even more portable applications [6]. Current 3D mapping system based on structured light illumination already rely on DOEs as precision pattern generators that are used for accurate 3D depth determination.…”
Section: Introductionmentioning
confidence: 99%