2006 IEEE MTT-S International Microwave Symposium Digest 2006
DOI: 10.1109/mwsym.2006.249698
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Compact Electrothermal Modeling of an X-band MMIC

Abstract: Compact electrothermal modeling of lumped electrical devices and compact thermal modeling of volumetric materials enables efficient electrothermal modeling of microwave circuits. The compact thermal model of the body of an X-band MMIC is based on analytical solutions of the heat diffusion equation in thermal sub-volumes. The model is accurate and captures thermal nonlinearities. The model considers complex MMIC features such as surface metallization and vias, as well as the mounting configurations including le… Show more

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Cited by 7 publications
(7 citation statements)
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“…The performance of the proposed analysis is compared with the previously available state‐variable transient analyses, types: Tran (uses a sparse‐matrix formulation, see Ref. [37]) and Tran2 (uses the formulation of Eq. (8), see Ref.…”
Section: Simulation Resultsmentioning
confidence: 99%
“…The performance of the proposed analysis is compared with the previously available state‐variable transient analyses, types: Tran (uses a sparse‐matrix formulation, see Ref. [37]) and Tran2 (uses the formulation of Eq. (8), see Ref.…”
Section: Simulation Resultsmentioning
confidence: 99%
“…(3) [7]. Results from Tran2 are assumed to be correct, as these analysis has been previously verified against measurements and other circuit simulators [9,10]. The performance of the proposed method for different circuits is summarized in Table 1.…”
Section: Simulation Resultsmentioning
confidence: 99%
“…Circuit 2 is shown in Fig. 3 and is composed of 5 MMIC LNA [9] each connected to a soliton line (Circuit 1) at the output stage, each LNA fed with a different input frequency. The size of the modified nodal admittance matrix (MNAM) in each circuit are given in the table to give an idea of the problem size.…”
Section: Simulation Resultsmentioning
confidence: 99%
“…To overcome the computational expense, 'weakly-coupled' approaches have been defined where electromagnetic simulation results (through S-parameters), thermal models (through a thermal impedance matrix), and nonlinear electrothermal transistor models are coupled in the netlist of a circuit simulator. This provides a comprehensive description of the transistor for computationally efficient simulation [6]- [8], [12], [18].…”
Section: Introductionmentioning
confidence: 99%