We propose a new cost-effective structure for a future 100 Gbit/s-class optoelectronic integrated circuit (OEIC) with optical interconnection and a receiver module. This module is a flat compact package and achieves good optical and high-speed electrical performance. A polymeric optical waveguide and a curved micro-mirror are monolithically integrated on the OEIC as the optical interconnection. Furthermore, this OEIC chip is assembled using solder bumps and passively self-aligned technique. We confirmed the feasibility of applying this novel structure to future cost-effective 100-Gbit/s class receiver modules.