Communication—Fabrication of Vertical Nanotwinned Copper with (220) Texture by Direct Current Electrodeposition

Abstract

Vertical nanotwinned copper film with (220) texture was fabricated on Si wafer with (111) oriented copper seed layer by direct current electrodeposition. A commercial additive and high current density were applied to control the preferred orientation and formation of nanotwins. The twin boundaries are (111) crystal planes, which are perpendicular to the substrate and parallel to the growth direction. It’s inferred that high cathode potential as a result of high current density can induce (220) texture, which is found to be an essential factor for the formation of vertical nanotwinned copper.

Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging

“…Later, researchers found that some organic molecules could promote nanotwin growth during the DC electroplating process. Yu Bai and coworkers [ 61 ] fabricated vertical nt-Cu with a (220) texture through DC electroplating at a high current density of about 3–5 A/dm 2 (ASD) with commercial additives. In 2022, Zhong-Guo Li and coworkers [ 62 ] demonstrated that gelatin could work as an inhibitor in the DC electrodeposition process with electrochemical measurements.…”