Communication—A Novel Method to Improve Cleaning Performance by Removing Small Particles in CMP Slurry

Abstract

In the present study, a separation system with a tangential flow filter (TFF) was applied to reduce the number of small ceria particles in chemical mechanical polishing slurry. The small ceria particles were reduced by 30.7% via the TFF system, and slurry properties of particle mean diameter, pH, zeta potential, and solids concentration were maintained. There was no significant difference in removal rate between original and TFF-treated slurry. In addition, the cleaning efficiency with the TFF system was improved by 34.7% compared to that without the TFF system.