Combined TEM and XPS studies of metal - polymer interfaces for space applications

Pütz, Barbara; Milassin, Gabor; Butenko, Yu. V.; Völker, Bernhard; Gammer, Christoph; Semprimoschnig, Christopher; Cordill, Megan J.

doi:10.1016/j.surfcoat.2017.07.079

Cited by 25 publications

(36 citation statements)

References 31 publications

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“…A layer of PI remaining on the Al side from cohesive failure in the polymer during peeling located more than about 10 nm below the Al‐PI interface would result in surface compositions similar to the PI side and can therefore be excluded. The composition of the as‐deposited Al surface is in good agreement with a previous study by the authors (33% C, 1% N, 44% O, and 22% Al), which showed that peeling induces interfacial failure at the interface between the PI substrate and the thin interlayer (IL), described in the introduction. Hence, interfacial failure is assumed for the as‐deposited state, where the IL remains on the Al side after peeling.…”

Section: Resultssupporting

confidence: 91%

“…Studies focusing on interface formation found that chemical reactions between metal atoms and functional groups of certain substrates can form complexes and cause the formation of a thin interlayer between the metal and the polymer. In the case of the Al‐PI system studied in this work, the presence of such an Al‐O‐C interlayer has been shown (amorphous microstructure, thickness 3.6 nm) and was attributed to good interfacial adhesion …”

Section: Introductionmentioning

confidence: 70%

“…To access the Al‐PI interface for XPS investigations, a 180° peel test was used following the approach described in ref. . The peel test produces an adequately sized area without altering the interface chemistry.…”

Section: Methodsmentioning

confidence: 99%

“…Cross‐sectional TEM samples (JEOL 2100F, image side spherical aberration corrected, acceleration voltage 200 kV) were prepared from as‐deposited and annealed material using a manually glued sample stack geometry described in ref. . Electron transparent samples were prepared following a standard procedure described in Strecker et al which includes dimple polishing both sides of the sample followed by Ar + ion milling in a Gatan precision ion polishing system (PIPS II, model 695) with liquid N 2 cooling.…”

Section: Methodsmentioning

confidence: 99%

“…Ideal interface chemistry and structure are necessary to sustain thermal treatments and avoid delamination and fatal failure of the composite during use. For thin films, various delamination mechanisms have been identified, commonly using XPS and/or TEM analysis . Among the most frequently reported ones are interfacial separation and cohesive failure in the polymer in vicinity of the interface, depending on the ratio between adhesive strength of the interface and cohesive strength of the substrate.…”

Section: Introductionmentioning

confidence: 99%

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Interfacial mutations in the Al‐polyimide system

Pütz

Milassin

Butenko

et al. 2018

Surface & Interface Analysis

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Understanding the thermal stability of metal-polymer interfaces is essential for the reliability of innovative high-tech devices, including flexible electronics or satellite insulation. In this study, the interfacial stability of aluminum-polyimide (Al-PI) is investigated as a function of thermal cycling (±150°C) and thermal annealing treatments (150°C-300°C) with X-ray photoelectron spectroscopy measurements performed after peeling and cross-sectional transmission electron microscopy analysis. Small mutations in the interface chemistry and structure were detected and identified after annealing at 225°C for 140 hours, including the thickness increase of an amorphous interlayer between Al and PI of about 2 nm and a change in the failure mechanism during the peeling. Being able to trace subcritical mutations before they become fatal is essential to predict the reliability and lifetime of metal-polymer composites.

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Section: Resultssupporting

confidence: 91%

Section: Introductionmentioning

confidence: 70%

Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Interfacial mutations in the Al‐polyimide system

Pütz

Milassin

Butenko

et al. 2018

Surface & Interface Analysis

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Electromechanical Behavior of Al/Al₂O₃Multilayers on Flexible Substrates: Insights from In Situ Film Stress and Resistance Measurements

et al. 2022

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In recent years, nanoscale metal/ceramic multilayers have come into greater focus as they exhibit promising mechanical, physical, and chemical properties, useful for a wide range of thermal, mechanical, and environmental conditions. Main efforts include manufacturing and characterization [1][2][3][4][5][6] of such structures as well as different experimental [4,5,[7][8][9][10][11][12][13][14][15] and modeling [9,13,[16][17][18][19] approaches to understand their deformation mechanisms and optimize mechanical properties. Enhancement in both, multilayer hardness and ductility, is achieved compared to rule of mixture values, depending on the bilayer thickness, the thickness ratio between ceramic and metal layers, and interfacial properties. [9,13] For thin layers (>10 nm) the metal can undergo elasticplastic deformation while the ceramic layer deforms elastically until it fails due to cracking; [4] alternatively, highly localized shear deformation may occur as a result of localized stresses at the interfaces. [5,9,15,17,19] When the layer thickness is reduced to a few nanometers, ultra-thin ceramics can plastically co-deform with metal layers, as has been demonstrated for Al/TiN. [4,18] Substantial intrinsic ductility at small scales has also been demonstrated for amorphous oxides (40 nm Al 2 O 3 ) [20] provided that the material is dense and free of geometrical flaws, whereby mechanical characterization remains experimentally challenging.Metal/ceramic multilayers are of interest for flexible thin-film applications, providing a unique combination of high strength, good conductivity, and potential damage tolerance due to sublayer fragmentation and crack deflection at interfaces.

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Bond Formation at Polycarbonate | X Interfaces (X = Al₂O₃, TiO₂, TiAlO₂) Studied by Theory and Experiments

Patterer,

Ondračka,

Bogdanovski

et al. 2024

Adv Materials Inter

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Interfacial bond formation during sputter deposition of metal‐oxide thin films onto polycarbonate (PC) is investigated by ab initio molecular dynamics simulations and X‐ray photoelectron spectroscopy (XPS) analysis of PC|X interfaces (X = Al2O3, TiO2, TiAlO2). Generally, the predicted bond formation is consistent with the experimental data. For all three interfaces, the majority of bonds identified by XPS are (C─O)─metal bonds, whereas C─metal bonds are the minority. Compared to the PC|Al2O3 interface, the PC|TiO2 and PC|TiAlO2 interfaces exhibit a reduction in the measured interfacial bond density by 75 and ∼65%, respectively. Multiplying the predicted bond strength with the corresponding experimentally determined interfacial bond density shows that Al2O3 exhibits the strongest interface with PC, while TiO2 and TiAlO2 exhibit ∼70 and ∼60% weaker interfaces, respectively. This can be understood by considering the complex interplay between the metal‐oxide composition, the bond strength, and the population of bonds formed across the interface.

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Combined TEM and XPS studies of metal - polymer interfaces for space applications

Cited by 25 publications

References 31 publications

Interfacial mutations in the Al‐polyimide system

Interfacial mutations in the Al‐polyimide system

Electromechanical Behavior of Al/Al₂O₃Multilayers on Flexible Substrates: Insights from In Situ Film Stress and Resistance Measurements

Bond Formation at Polycarbonate | X Interfaces (X = Al₂O₃, TiO₂, TiAlO₂) Studied by Theory and Experiments

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Combined TEM and XPS studies of metal - polymer interfaces for space applications

Cited by 25 publications

References 31 publications

Interfacial mutations in the Al‐polyimide system

Interfacial mutations in the Al‐polyimide system

Electromechanical Behavior of Al/Al2O3Multilayers on Flexible Substrates: Insights from In Situ Film Stress and Resistance Measurements

Bond Formation at Polycarbonate | X Interfaces (X = Al2O3, TiO2, TiAlO2) Studied by Theory and Experiments

Contact Info

Product

Resources

About

Electromechanical Behavior of Al/Al₂O₃Multilayers on Flexible Substrates: Insights from In Situ Film Stress and Resistance Measurements

Bond Formation at Polycarbonate | X Interfaces (X = Al₂O₃, TiO₂, TiAlO₂) Studied by Theory and Experiments