Combined Pirani/bending membrane-pressure sensor

Baar, J.J. van; Wiegerink, Remco J.; Lammerink, Theodorus S.J.; Berenschot, J.W.; Krijnen, Gijs; Elwenspoek, M.

doi:10.1109/memsys.2002.984269

Cited by 6 publications

(2 citation statements)

References 3 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This Pirani sensor could detect pressure by measuring the temperature distribution of the heater rather than the average temperature change of the heater. The advantage of this Pirani sensor compared to the previous vertically structured thermistor type sensors is that it does not need to take into account the TCR magnitude of the heater materials, thus implicitly taking into account the heat loss of the substrate [76,77].…”

Section: Vertical Heat Transfer Configurationmentioning

confidence: 99%

Overview of the MEMS Pirani Sensors

Zhou

Shi

et al. 2022

Micromachines

View full text Add to dashboard Cite

Vacuum equipment has a wide range of applications, and vacuum monitoring in such equipment is necessary in order to meet practical applications. Pirani sensors work by using the effect of air density on the heat conduction of the gas to cause temperature changes in sensitive structures, thus detecting the pressure in the surrounding environment and thus vacuum monitoring. In past decades, MEMS Pirani sensors have received considerable attention and practical applications because of their advances in simple structures, long service life, wide measurement range and high sensitivity. This review systematically summarizes and compares different types of MEMS Pirani sensors. The configuration, material, mechanism, and performance of different types of MEMS Pirani sensors are discussed, including the ones based on thermistors, thermocouples, diodes and surface acoustic wave. Further, the development status of novel Pirani sensors based on functional materials such as nanoporous materials, carbon nanotubes and graphene are investigated, and the possible future development directions for MEMS Pirani sensors are discussed. This review is with the purpose to focus on a generalized knowledge of MEMS Pirani sensors, thus inspiring the investigations on their practical applications.

show abstract

Section: Vertical Heat Transfer Configurationmentioning

confidence: 99%

Overview of the MEMS Pirani Sensors

Zhou

Shi

et al. 2022

Micromachines

View full text Add to dashboard Cite

show abstract

“…Pressure sensors using micro electro mechanical systems (MEMS) technology that are small and suited for high integration are commonly used to control these mechanical systems. Among these pressure sensors, silicon diaphragm pressure sensors are used [2,3]. With such sensors, the pressurereceiving diaphragm is formed on the silicon chip, on which the measurement area and the processing circuit are integrated.…”

Section: Introductionmentioning

confidence: 99%

Development of Corrosion‐Resistant Pressure Sensor with Semiconductor Strain Sensor

Suzuki

Oota

Umeyama

2018

Electrical Engineering Japan

View full text Add to dashboard Cite

In automotive and industrial fields, pressure sensors are a key component for precisely controlling the mechanical systems. Conventional micro electro mechanical system (MEMS)-based pressure sensors have an advantage in noise resistance, because both strain gauges and control circuits are integrated in one chip. However, the MEMS-based pressure sensors are generally fabricated on an Si substrate, and have a low stability against various active gases. Thus, we have newly proposed a pressure sensor which consists of an Si-based strain sensor set on a stainless steel diaphragm with a high stability against the active gases. The key technology is that a Koval plate is inserted between the strain sensor and the stainless steel diaphragm, for preventing the breakage or the delamination of the strain sensor at the bonding interface due to a difference in thermal expansion. Structure of the sensor including the shape and the size of Koval plate and the assembly position of the strain sensor were designed using structural simulation and experiments. Eventually, the 2.8 mm wide and 0.17 mm thick Koval beam was bridged on the stainless steel diaphragm for efficiently transmitting the diaphragm deformation to the strain sensor. The strain sensor was assembled at the edge of Koval beam with a glass bonding technique. Consequently, the developed pressure sensor has achieved a small dispersion of less than 1% F. S. in a temperature range from 0°C to 85°C. C⃝ 2018 Wiley Periodicals, Inc. Electr Eng Jpn, 203(2): 58-65, 2018; Published online in Wiley Online Library (wileyonlinelibrary.com).

show abstract