2009 IEEE International Conference on IC Design and Technology 2009
DOI: 10.1109/icicdt.2009.5166277
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Combined altitude and underground real-time SER characterization of CMOS technologies on the ASTEP-LSM platform

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Cited by 5 publications
(6 citation statements)
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“…Most of MCU multiplicity, the number of bit flips in same MCU occurrence, concerns 2 and 3 contacts respectively. So, the simulation confirms that the MCU due to alpha emitters is not significant in the 130 nm SRAM technology in accordance with Real-time underground experiment [6], [7]. Contrary to the case of the neutron (in altitude or ground level) or heavy ion with directly impact on several SRAM, the energy deposition of the alpha emitter is relatively low and only track near contacts induced a SEU which explained the absence of MCU formation in ground level.…”
Section: Monte-carlo Simulation Of the -Sersupporting
confidence: 81%
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“…Most of MCU multiplicity, the number of bit flips in same MCU occurrence, concerns 2 and 3 contacts respectively. So, the simulation confirms that the MCU due to alpha emitters is not significant in the 130 nm SRAM technology in accordance with Real-time underground experiment [6], [7]. Contrary to the case of the neutron (in altitude or ground level) or heavy ion with directly impact on several SRAM, the energy deposition of the alpha emitter is relatively low and only track near contacts induced a SEU which explained the absence of MCU formation in ground level.…”
Section: Monte-carlo Simulation Of the -Sersupporting
confidence: 81%
“…It is well known that MCU formation due to only alpha-emitters [6], [7] (Multi Cell Upset) in the 130 nm SRAM technology is not detected experimentally. But in our simulation several cases statistically appear; this represents less than 3 % of the total bit flip and 1% of the total event.…”
Section: Monte-carlo Simulation Of the -Sermentioning
confidence: 99%
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