Smart Colloidal Materials
DOI: 10.1007/3-540-32702-9_25
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Colloidchemical Interactions of Silica Particles in the Cu-CMP-Process

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Cited by 3 publications
(1 citation statement)
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“…One simple but important application of nanoparticles has been in the development of abrasives for polishing surfaces in the semiconductor industry (Nennemann et al , 2006 ). If a material is to be patterned with an electronic circuit on the sub 100 nm scale then the surface cannot contain any defects in this size range.…”
Section: Abrasivesmentioning
confidence: 99%
“…One simple but important application of nanoparticles has been in the development of abrasives for polishing surfaces in the semiconductor industry (Nennemann et al , 2006 ). If a material is to be patterned with an electronic circuit on the sub 100 nm scale then the surface cannot contain any defects in this size range.…”
Section: Abrasivesmentioning
confidence: 99%