2007
DOI: 10.1007/s00542-007-0416-z
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Collapse-free thermal bonding technique for large area microchambers in plastic lab-on-a-chip applications

Abstract: Bonding is an essential step to form microchannels or microchambers in lab-on-a-chip applications. In this paper, we present a novel plastic thermal bonding technique to seal and form large area microchambers (planar characteristic width and length on the order of 1 mm and characteristic thickness on the order of 10-100 lm) without collapse by introducing a holed pressure equalizing plate (HPEP) that includes holes of the same size and shape as the microchambers. To demonstrate the proposed technique, two type… Show more

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Cited by 18 publications
(8 citation statements)
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References 10 publications
(12 reference statements)
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“…Among several thermoplastics, cyclic olefin copolymers (COC) and polymethylmethacrylate (PMMA) are frequently exploited for making microfluidic devices. These devices were often fabricated by bonding a cover sheet with a substrate containing microchannels and other microfeatures using various bonding methods including thermal fusion,3-7 solvent bonding,8-14 surface treatment,15-20 and adhesives 21, 22. Each of these methods has advantages and disadvantages as reviewed in the literature 1, 2…”
mentioning
confidence: 99%
“…Among several thermoplastics, cyclic olefin copolymers (COC) and polymethylmethacrylate (PMMA) are frequently exploited for making microfluidic devices. These devices were often fabricated by bonding a cover sheet with a substrate containing microchannels and other microfeatures using various bonding methods including thermal fusion,3-7 solvent bonding,8-14 surface treatment,15-20 and adhesives 21, 22. Each of these methods has advantages and disadvantages as reviewed in the literature 1, 2…”
mentioning
confidence: 99%
“…Subsequently, the structured substrate was covered with a flat PS substrate via collapse-free thermal bonding technique. 20 To verify moldability of the LOD designs, injection molding using metal mold has been conducted to fabricate the preliminary LOD containing the C-MUFID and the CSM on a trial basis. Consequently, injection molding of the preliminary LOD was successfully achieved as described in supplementary Fig.…”
Section: A Lod Fabricationmentioning
confidence: 99%
“…Among various polymeric materials suitable for micromolding of microfluidic chips, the cyclic olefin copolymer (COC) shows several excellent properties, for instance good moldability, high transparency, biocompatibility, and so forth. Furthermore, the molded COC articles can be easily bonded together by a thermal bonding technique [20], which is essential for constructing closed microfluidic devices. In this regard, COC (Topas 5013, Ticona) was selected as a molding material in the present study.…”
Section: Microinjection Molding Processmentioning
confidence: 99%