2021
DOI: 10.1587/elex.18.20200425
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Collaborative thermal- and traffic-aware adaptive routing scheme for 3D network-on-chip systems

Abstract: Due to the stacking dies and unequal cooling effiency of different layers, 3D NoC-based systems suffer sever thermal issues. Adaptive routing can alleviate the thermal issues, but current routing algorithms either suffer from the thermal balance or traffic congestion. This paper proposed a collaborative thermal-and traffic-aware adaptive routing (CTTAR) scheme, which considers the traffic and temperature information together and avoids the packets transferring to congested region. Experiments show that, there … Show more

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Cited by 2 publications
(3 citation statements)
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“…A collaborative thermal-aware adaptive routing (CTTAR) strategy [19] is presented for synchronizing network traffic and temperature information. Due to unnecessary packet switching in routers, hotspots are produced.…”
Section: Related Workmentioning
confidence: 99%
“…A collaborative thermal-aware adaptive routing (CTTAR) strategy [19] is presented for synchronizing network traffic and temperature information. Due to unnecessary packet switching in routers, hotspots are produced.…”
Section: Related Workmentioning
confidence: 99%
“…Fully adaptive routing indicates improvement in thermal distribution without performance degradation to lower the temperature and meet the performance specifications of high priority packets. A collaborative thermal-aware adaptive routing (CTTAR) scheme [4] to synchronize network traffic and thermal information is presented. Since unnecessary packet switching causes hotspots, the CTTAR first employs dynamic buffer change, which can restrict the routing resource around overheated regions to slow the rate of temperature increase based on expected thermal details.…”
Section: Literature Reviewmentioning
confidence: 99%
“…Cooling mechanisms also known as heat sinks usually exist on only one side of the chip in multi-layer 3D NoC. Hence, layers further away from the heat sink have higher possibility of the thermal hotspots [4]. Due to these thermal hotspot difficulties and aggravation of failure mechanism puts an extra strain on cooling cost of the chip and reliability reduction in 3D NoC.…”
Section: Introductionmentioning
confidence: 99%