Cold Curing Composite Materials Based on ED-20 Epoxy Resin and Modified with Silicon–Heteroorganic Compounds

Abstract

Epoxy oligomers are among the most common types of binder, for some time have been widely used as the base material of adhesives, reinforced plastics, and coatings, and can be cured in a wide temperature range. Systems cured at room or reduced temperatures have a number of shortcomings associated with the limited choice of curing agents. The product of interaction between phenol, formaldehyde, and ethylenediamine-AF-2 [1]is the most commonly used cold curing agent.

Monitoring the curing processes of epoxy oligomers with partially substituted polyethoxymetallosiloxanes by IR spectroscopy and thermomechanical analysis

“…Later, the possibility of using oligomers obtained by condensation of tetrabutoxytitanium with diphenylsilanediol as modifiers of the curing process of «ED‐20» epoxy resin was shown. Unfortunately, the structure of these modifiers was not determined; therefore, the curing products are rather difficult to control 33 . On the other hand, filling an epoxy resin with titanium and zinc oxides combined with silica can increase the mechanical strength compared to filling with silica alone, and at the same time, it gives the material antimicrobial properties against Staphylococcus aureus and Escherichia coli 34 .…”