Cold-Cured Bisphenolic Epoxy Adhesive Filled with Low Amounts of CaCO3: Effect of the Filler on the Durability to Aqueous Environments

Abstract

The effects of aging exposures to three non-saline aqueous environments on the compressive mechanical properties of a calcium carbonate-filled bisphenolic epoxy adhesive, cold-cured with the addition of two curing agents suitable for the cure at ambient temperature (i.e., Mannich base and triethylenetetramine), were assessed. The amount of the added filler (CaCO3) varied from 1 to 3 g per 100 g of resin; the immersion times in each of the selected medium varied from 1 to 10 months. It was found that the mechanical properties measured in compression mode on cylindrical specimens of unfilled and CaCO3-loaded epoxy were scarcely influenced by the kind of curing agent employed; only the compressive modulus was limitedly affected by this parameter. Referring to the behavior when aged in water, the CaCO3-filled epoxies displayed noticeable growths in modulus, small reductions in strength, and limited variations in strain, with a certain influence of the exposure time, especially when comparing the properties at the lowest time with those at medium–long times. On the basis of the results of statistical MANOVA analysis, it can be concluded that among the compositional factors (i.e., the type of curing agent employed to cure the epoxy compounds and the micro-filler content), only the amount of CaCO3 filler significantly affects the compressive modulus.

Effect of Silicon Wafer Surface Stains on Copper-Assisted Chemical Etching

“…During the production of some polymer materials, CaCO 3 , SiO 2 , and other inorganic fillers are often added to glues, rubbers, and other polymeric materials to ensure their mechanical properties and flame retardancy. The results further confirmed that the white spot stains emanated from organic polymer components [32,33]. During the slicing of the silicon wafer, the surface of the silicon wafer will only contact the diamond wire.…”

Effect of silicon wafer surface stains on copper-assisted chemical etching

“…During the production of some polymer materials, to ensure their mechanical properties and ame retardancy, CaCO 3 , SiO 2 , and other inorganic llers are often added to the glues, rubbers, and other polymeric materials. The results further con rmed that the white spot stains were an organic polymer [28,29].…”

Mechanical Properties of Epoxy Compounds Based on Unmodified Epoxy Resin Modified with Boric Acid as an Antiseptic

“…Epoxy resins are used in electronics as well as electrical, automotive, marine, aviation, and construction industries [ 6 , 7 ]. Apart from their main application for joining various materials, they are used as basic components of composites, nanocomposites and laminates [ 7 , 8 , 9 , 10 , 11 ], coatings [ 12 , 13 , 14 , 15 , 16 , 17 ], polymer floors, paints, sealants and impregnates, as well as medical materials characterized by, e.g., antibacterial properties [ 9 , 16 , 18 , 19 , 20 , 21 ].…”