Coelectrodeposited Solder Composite Films for Advanced Thermal Interface Materials

Raj, P. Markondeya; Gangidi, P. R.; Nataraj, N.; Kumbhat, Nitesh; Jha, G.; Tummala, Rao; Brese, N. E.

doi:10.1109/tcpmt.2013.2249583

Cited by 7 publications

(4 citation statements)

References 16 publications

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“…Raj et al recently demonstrated a concept of co-electrodeposition of solder films with filler particles incorporated [111]. It was demonstrated with SiC and graphite fillers into a Sn matrix, but can be extended to other solders as well.…”

Section: Continuous Metal Phase-based Timsmentioning

confidence: 99%

Novel nanostructured thermal interface materials: a review

Hansson

Nilsson

et al. 2017

International Materials Reviews

308

191

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The trend of continuing miniaturisation of microelectronics leads to new thermal management challenges. A key point in the heat removal process development is to improve the heat conduction across interfaces through improved thermal interface materials (TIMs). We identify the key areas for state-of-the art TIM research and investigate the current state of the field together with possible future advances.

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Section: Continuous Metal Phase-based Timsmentioning

confidence: 99%

Novel nanostructured thermal interface materials: a review

Hansson

Nilsson

et al. 2017

International Materials Reviews

308

191

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“…As mentioned, CTE mismatch is one of the major issues in the application of low melting point metals and alloys. To improve the CTE, Raj et al co-deposited SiC and graphite a commercial tin bath [98]. A 30 and 70% volume loading was achieved for the SiC and graphite particles in the composites, which was projected to achieve a CTE of 5-10 ppm °C−1 , which is in the range of semiconductor material.…”

Section: Metals: Solders and Low Melting Temperature Alloy Timsmentioning

confidence: 99%

Present and future thermal interface materials for electronic devices

Razeeb

Dalton

Cross

et al. 2017

International Materials Reviews

273

164

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Packaging electronic devices is a growing challenge as device performance and power levels escalate. As device feature sizes decrease, ensuring reliable operation becomes a challenge. Ensuring effective heat transfer from an integrated circuit and its heat spreader to a heat sink is a vital step in meeting this challenge. The projected power density and junction-toambient thermal resistance for high-performance chips at the 14 nm generation are >100 Wcm −2 and <0.2 °CW −1 , respectively. The main bottleneck in reducing the net thermal resistance are the thermal resistances of the thermal interface material (TIM). This review evaluates the current state of the art of TIMs. Here, the theory of thermal surface interaction will be addressed and the practicalities of the measurement techniques and the reliability of TIMs will be discussed. Furthermore, the next generation of TIMs will be discussed in terms of potential thermal solutions in the realisation of Internet of Things.

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“…Fillers [36][37][38][39][40][41] have been added to solders to form solder-matrix composites that exhibit decreased values of coefficient of thermal expansion (CTE) and/or enhanced creep resistance. Graphite particles (100 nm to 500 nm) up to 70 vol.% have been added to tin in order to reduce the CTE; 38 nanosized graphite (400 nm size) has been added to Sn-Bi solder in order to improve the creep resistance, but the addition harms the spreadability of the solder; 39 copper particles have been added to Sn-Zn solder for improving the creep resistance; 40 carbon nanotubes have been added to Sn-Ag-Cu solder for decreasing the CTE, improving the thermal stability, and decreasing the intermetallic compound thickness.…”

Section: Introductionmentioning

confidence: 99%

“…Graphite particles (100 nm to 500 nm) up to 70 vol.% have been added to tin in order to reduce the CTE; 38 nanosized graphite (400 nm size) has been added to Sn-Bi solder in order to improve the creep resistance, but the addition harms the spreadability of the solder; 39 copper particles have been added to Sn-Zn solder for improving the creep resistance; 40 carbon nanotubes have been added to Sn-Ag-Cu solder for decreasing the CTE, improving the thermal stability, and decreasing the intermetallic compound thickness. 36,41 By incorporating 29 vol.% continuous copper-plated carbon fibers in 60Sn-40Pb solder, the CTE is lowered from 24 9 10 À6 /°C to 8 9 10 À6 /°C.…”

Section: Introductionmentioning

confidence: 99%

Solder–Graphite Network Composite Sheets as High-Performance Thermal Interface Materials

Sharma

Chung

2015

Journal of Elec Materi

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Low-cost solder-graphite composite sheets ( ‡55 vol.% solder), with solder and graphite forming interpenetrating networks to a degree, are excellent thermal interface materials (TIMs). Solders 63Sn-37Pb and 95.5Sn-4Ag-0.5Cu are separately used, with the latter performing better. In composite fabrication, a mixture of micrometer-size solder powder and ozone-treated exfoliated graphite is compressed to form a graphite network, followed by fluxless solder reflow and subsequent hot pressing to form the solder network. The network connectivity (enhanced by ozone treatment) is lower in the through-thickness direction. The electrical conductivity obeys the rule of mixtures (parallel model in-plane and series model through-thickness), with anisotropy 7. Thermal contact conductance £26 9 10 4 W/(m 2 K) (with 15-lm-roughness copper sandwiching surfaces), through-thickness thermal conductivity £52 W/ (m K), and in-plane thermal expansion coefficient 1 9 10 À5 /°C are obtained. The contact conductance exceeds or is comparable to that of all other TIMs, provided that solder reflow has occurred and the composite thickness is £100 lm. Upon decreasing the thickness below 100 lm, the sandwich thermal resistivity decreases abruptly, the composite through-thickness thermal conductivity increases abruptly to values comparable to the calculated values based on the rule of mixtures (parallel model), and the composite-copper interfacial thermal resistivity (rather than the composite resistivity) becomes dominant.

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Coelectrodeposited Solder Composite Films for Advanced Thermal Interface Materials

Cited by 7 publications

References 16 publications

Novel nanostructured thermal interface materials: a review

Novel nanostructured thermal interface materials: a review

Present and future thermal interface materials for electronic devices

Solder–Graphite Network Composite Sheets as High-Performance Thermal Interface Materials

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