Codeposition of copper and tin from acidic sulfate solutions containing polyethylene glycols. Effect of length of the hydrocarbon chain

Survila, Arvydas; Bražinskienė, Dalia; Kanapeckaitė, S.; Mockus, Z.; Jasulaitienė, Vitalija

doi:10.1007/s10008-008-0736-7

Cited by 6 publications

(11 citation statements)

References 16 publications

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“…At the same time, the lustre characteristics of the coatings improve. The latter tendency was also observed in systems with other polyethercontaining additives [15,16,24].…”

Section: Resultssupporting

confidence: 57%

“…In addition, our recent investigations [15,16,24] demonstrated that Cu-Sn coatings obtained in the presence of some polyethers contain the intermediate hexagonal hcp phase. When heated at 350°C this phase transforms into f-Cu 10 Sn 3 .…”

Section: Resultsmentioning

confidence: 97%

“…[11][12][13][14][15][16]. According to [13,14], the effect of Sintanol on the kinetics of both Cu(II) and Sn(II) reduction occurring independently is similar to the effect of other polyethers.…”

Section: Introductionmentioning

confidence: 77%

“…Basically polyethers, and in particular Sintanol, in halide-free solutions do not behave like surfactants on copper substrates. In contrast, the inhibition ability of Sintanol on tin has been observed many times [8,10,[13][14][15][16][17][18][19][20]. According to [16,21], the length of the hydrocarbon chain is the major factor responsible for the inhibition activity of polyethers on tin, e.g.…”

Section: Introductionmentioning

confidence: 96%

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Codeposition of copper and tin from acid sulphate solutions containing polyether sintanol DS-10 and benzaldehyde

Survila¹,

Mockus²,

Kanapeckaitė³

et al. 2009

J Appl Electrochem

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Cu(II) and Sn(II) reduction in acid sulphate solutions containing polyether laprol DS-10 and benzaldehyde (BA) was studied by means of impedance, voltammetric, XPS and XRD techniques. Both additives demonstrate weak surface activity on copper substrate in Cu(II) solutions in the absence of halide impurities. In contrast, their effect is overwhelmingly higher in the Sn|Sn(II) system. The additives induce a significant increase in Sn-electrode impedance and simultaneous strong inhibition of Sn(II) reduction over a wide range of cathodic polarizations. The effects of sintanol and BA in mixed Cu(II) and Sn(II) solutions demonstrate a kind of synergism. Underpotential deposition of tin on foreign (copper) substrate is observed at potentials more positive than the equilibrium potential of the Sn|Sn 2? system. Incorporation of tin into the Cu crystalline lattice results in the formation of multiphase material containing pure copper, a-CuSn phase, and intermediate hexagonal hcp phase. Formation of the pure tin phase occurs at more negative potentials and results in a strong inhibitive adsorption that manifests itself in the development of a deep voltammetric minimum. The tin content in the coatings depends on BA concentration and, particularly, on the electrode potential.

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“…At the same time, the lustre characteristics of the coatings improve. The latter tendency was also observed in systems with other polyethercontaining additives [15,16,24].…”

Section: Resultssupporting

confidence: 57%

Section: Resultsmentioning

confidence: 97%

Section: Introductionmentioning

confidence: 77%

Section: Introductionmentioning

confidence: 96%

See 2 more Smart Citations

Codeposition of copper and tin from acid sulphate solutions containing polyether sintanol DS-10 and benzaldehyde

Survila¹,

Mockus²,

Kanapeckaitė³

et al. 2009

J Appl Electrochem

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“…A specific feature of electrochemically deposited bronze coatings is the presence of various phases that are thermodynamically stable only at high temperatures. In addition, our recent investigations (35,36,39) demonstrated that Cu-Sn coatings obtained in the presence some polyethers contain the intermediate hexagonal hcp phase. When heated at 350 o C this phase transforms into ζ-Cu 10 Sn 3 .…”

Section: Codeposition Of Copper and Tinmentioning

confidence: 92%

Surfactant Effects in Cu-Sn Alloy Deposition

et al. 2011

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Adsorption behavior of different polyethers (PE) on copper and tin was studied in combination with kinetic investigations. No pronounced effect of PE was detected in Cu|Cu(II) system. In contrast, these substances show a high inhibition activity on the tin electrode. Halides enhance adsorption ability on copper electrode but suppress it on tin; this effect intensifies in the sequence: Cl -< Br -< I -. The inhibition degree of surfactants increases with the length of hydrocarbon chain. Underpotential deposition of Sn(II) is observed in the region of Cu(II) limiting current. Deposits obtained present a mixture of pure copper, α-CuSn phase and hcp phase. The characteristic current minimum arises in the region where the free Sn phase becomes thermodynamically stable. Cl -ions broaden the range of current densities where yellow bronze can be obtained, but Br -ions show the opposite effect. Iodides retard the reduction of Cu(II) and tin prevails in the coatings.

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Electrochemical Deposition of Alloys

Survila

2015

Electrochemistry of Metal Complexes

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Codeposition of copper and tin from acidic sulfate solutions containing polyethylene glycols. Effect of length of the hydrocarbon chain

Cited by 6 publications

References 16 publications

Codeposition of copper and tin from acid sulphate solutions containing polyether sintanol DS-10 and benzaldehyde

Codeposition of copper and tin from acid sulphate solutions containing polyether sintanol DS-10 and benzaldehyde

Surfactant Effects in Cu-Sn Alloy Deposition

Electrochemical Deposition of Alloys

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