2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2020
DOI: 10.1109/eurosime48426.2020.9152679
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Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization

Reinhard Schemmel
1
,
Viktor Krieger
2
,
Tobias Hemsel
3
et al.
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