2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) 2022
DOI: 10.1109/eptc56328.2022.10013202
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Co-packaging of PMUT array with FOWLP ASIC's

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Cited by 7 publications
(1 citation statement)
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“…Integrated circuits (ICs) and MEMS technology supported ultrasound-onchip platforms are of paramount importance in facilitating these advancements. [239] Recently, many electrical engineers dedicated to this field have proposed advanced systems, such as area-and power-efficient application-specific integrated circuit (ASIC) for a miniaturized 3-D ultrasound system, [240] a PMUTon-CMOS with a competitive noise efficient factor, [241] a compact high-voltage transmit circuit, [242] an analog-front-end circuit, [243] a PMUT device with the companion ASICs, [244] and a field-programmable gate array (FPGA)-based portable system. [245] As previously indicated, the structures of interest demand some tradeoffs in terms of the quality and strength of the signals that may be acquired when employing a conformable ultrasonic device.…”
Section: Integrated Systemmentioning
confidence: 99%
“…Integrated circuits (ICs) and MEMS technology supported ultrasound-onchip platforms are of paramount importance in facilitating these advancements. [239] Recently, many electrical engineers dedicated to this field have proposed advanced systems, such as area-and power-efficient application-specific integrated circuit (ASIC) for a miniaturized 3-D ultrasound system, [240] a PMUTon-CMOS with a competitive noise efficient factor, [241] a compact high-voltage transmit circuit, [242] an analog-front-end circuit, [243] a PMUT device with the companion ASICs, [244] and a field-programmable gate array (FPGA)-based portable system. [245] As previously indicated, the structures of interest demand some tradeoffs in terms of the quality and strength of the signals that may be acquired when employing a conformable ultrasonic device.…”
Section: Integrated Systemmentioning
confidence: 99%