Co-Optimization of Test Wrapper Length and TSV for TSV Based 3D SOCs

Kaibartta, Tanusree; Biswas, Gautam; Das, Debesh K.

doi:10.1007/s10836-020-05872-7

Cited by 3 publications

(1 citation statement)

References 19 publications

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“…With the rapid development of the aerospace industry, advanced electronic technology is gradually applied in the aerospace field (Kaibartta et al , 2020), such as the microsystem technology in radar application. In the harsh space environment, microsystems and electronic components will be affected by various rays in space, and the radiation effect of the device must be concerned during structural design.…”

Section: Introductionmentioning

confidence: 99%

Effects of ⁶⁰Co γ ray radiation on the transmission characteristics of interconnection structures for 3D packaging

Zhang

Liu

Cao

et al. 2022

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Purpose Concerning the radiation effects on the three-dimensional (3D) packaging in space environment, this study aims to investigate the influence of the total dose effect on the transmission characteristics of high-frequency electrical signals using experimental and simulation methods. Design/methodology/approach This work carries out the irradiation test of the specimens and measures their S21 parameters before and after irradiation. A simulation model describing the total dose effect was built based on the experimental test results. And, the radiation hardening design is evaluated by the simulation method. Findings The experimental results demonstrate that the S21 curve of the interconnection decreases with the increase of the irradiation dose, indicating that the total dose effect leads to the decline of its signal transmission characteristics. According to the simulation results, decreasing the height of the through silicon via (TSV), increasing the radius of the TSV, reducing the length of Si and increasing the number of grounded through silicon via have positive effects on improving the radiation resistance of the interconnection structure. Originality/value This work investigates the effect of radiation on the transmission characteristics of interconnection structures for 3D packaging and proposes the hardening design methods. It is meaningful for improving the reliability of 3D packaging in space applications.

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Section: Introductionmentioning

confidence: 99%