Co Effects upon Intermetallics Growth Kinetics in Sn-Cu-Co/Ni and Sn-Cu-Co/Cu Couples

Tseng, Yan-lun; Chang, Ya-chun; Chen, Chih-Chi

doi:10.1007/s11664-014-3517-3

Cited by 20 publications

(8 citation statements)

References 26 publications

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“…Remarkably, the dissolution of Co in Cu 6 Sn 5 and (Cu, Ni) 6 Sn 5 phases has no effect on the grain morphology but it does refine the grains on either substrate, as shown in Figures 12 and 13 [93]. With Co additions, the more sites for Cu 6 Sn 5 phase nucleation were provided, because the catalysing effect of Co, hence more Cu 6 Sn 5 was refined.…”

Section: Interfacial Reactionmentioning

confidence: 95%

“…The effects of minor Co additions on interface reactions of solders/Cu substrate have been investigated in the literature [90][91][92]. The micrographs of Sn-0.7Cu-Co/Ni interfacial reactions with Co additions were shown in Figure 11(a,b) [93].…”

Section: Interfacial Reactionmentioning

confidence: 99%

“…Grain morphology of the (Cu, Ni, Co) 6 Sn 5 phase formed in Sn-0.7Cu-Co/Ni couples. Reproduced with permission from[93].…”

mentioning

confidence: 99%

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Structure and properties of Sn-Cu lead-free solders in electronics packaging

Zhao

Liu

Xiong

et al. 2019

Science and Technology of Advanced Materials

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With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost. In this article, we present recent developments in Sn-Cu lead-free solder alloys. From the microstructure and interfacial structure, the evolution law of the internal structure of solder alloy/ solder joint was analysed, and the model and theory describing the formation/growth mechanism of interfacial IMC were introduced. In addition, the effects of alloying, particle strengthening and process methods on the properties of Sn-Cu lead-free solders, including wettability, melting and mechanical properties, were described. Finally, we outline the issues that need to be resolved in the future research. This figure presents the interface morphology of Sn-Cu-Ni-xPr joint. (a) x = 0, (b) x = 0.05wt%. It was clear that with the addition of 0.05% Pr, the thickness of IMC layer decreases significantly and the formation of voids at the interface is inhibited.

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Section: Interfacial Reactionmentioning

confidence: 95%

Section: Interfacial Reactionmentioning

confidence: 99%

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Structure and properties of Sn-Cu lead-free solders in electronics packaging

Zhao

Liu

Xiong

et al. 2019

Science and Technology of Advanced Materials

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“…Ag, Al, Co, Ga, Ge, In, Ni, Sb, Ti, Zn into a solder is a useful technique to improve the physical properties of the solder. Although these elements could improve certain properties of the solder, they could undesirably alter some properties of the alloy, and different alloying elements react variedly to different solder alloys [10][11][12][13][14][15][16][17][18][19][20][21].…”

Section: Contents Lists Available At Sciencedirectmentioning

confidence: 99%

Physical properties of Sn58Bi–xNi lead-free solder and its interfacial reaction with copper substrate

Kanlayasiri

Ariga

2015

Materials & Design

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“…Taking into account the specifically required considerations for some MEMS devices, such as CMOS compatibility, avoiding the chemical deposition on the device wafers, and chemical compatibility with the Cu-Sn SLID bonding, Co contact metallization is one of the plausible candidates [46]. In addition, it has been reported that Co can stabilize the HT-hexagonal Cu 6 Sn 5 , suppress Cu 3 Sn formation, and speed up IMC formation in the Cu-Sn SLID bonding system, which can reduce the SLID processing time and cost [46,55,56]. The microstructural evolution of the Co metal in contact with Cu-Sn has been previously investigated; depending on the bonding condition, various IMCs (such as (Cu,Co) 6 Sn 5 , Cu 3 Sn, (Co,Cu) Sn and (Co,Cu)Sn 3 ) can be evolved in the joint area [46,[56][57][58].…”

Section: Introductionmentioning

confidence: 99%