2015
DOI: 10.3390/s151229885
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Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems

Abstract: In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of external matching components, resulting in the realization of a small-size system. In addition, the technique employed to assemble a silicon large-scale integration (LSI) chip on the very thin parylene film (5 μm) enables… Show more

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Cited by 10 publications
(3 citation statements)
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“…There have been many designs of wireless neural stimulators that are relatively large in size (>1 mm 3 ) (Okabe et al, 2015 ; Zargham and Gulak, 2015 ; Larson and Nurmikko, 2016 ). The well-known RF BION uses inductive coupling at 2 MHz with a multi-turn coil with ferrite, but is ~10 times larger than our device, measuring 16 mm in length and 2 mm in diameter (Loeb et al, 2001 ).…”
Section: Discussionmentioning
confidence: 99%
“…There have been many designs of wireless neural stimulators that are relatively large in size (>1 mm 3 ) (Okabe et al, 2015 ; Zargham and Gulak, 2015 ; Larson and Nurmikko, 2016 ). The well-known RF BION uses inductive coupling at 2 MHz with a multi-turn coil with ferrite, but is ~10 times larger than our device, measuring 16 mm in length and 2 mm in diameter (Loeb et al, 2001 ).…”
Section: Discussionmentioning
confidence: 99%
“…Three key areas rapidly hastening the onset of effective intra-cortical BCIs include developments in: Electrodes and other implantable materials with reduced neuro-inflammatory responses, including recent advances in carbon nanotube (CNT) electrodes [16,17,18,19,20,21,22],Novel fabrications allowing much greater sensor density [23,24,25,26], andImproved wireless communication and power transmission technologies [27,28,29]. …”
Section: Introductionmentioning
confidence: 99%
“…Most common elastomeric materials have low dielectric constants. This low value can be increased by mixing the substrate with high dielectric constant materials such as ceramics like Ba x Sr 1−x TiO 3 [ 258 ] , BaTiO 3 [ 257 ], NdTiO 3 [ 259 ], MgCaTiO 2 [ 259 ], CNTs [ 260 ], and nanoparticles [ 261 ]. Metamaterial based flexible antenna is a relatively new development and has found its way in the commercial market because of its characteristics like lightweight, robustness, and reconfigurability [ 239 , 262 , 263 , 264 , 265 ].…”
Section: Challenges and Future Prospects Of Flexible Antennasmentioning
confidence: 99%