2022
DOI: 10.1016/j.compositesb.2022.109961
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CNT-assisted design of stable liquid metal droplets for flexible multifunctional composites

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Cited by 51 publications
(27 citation statements)
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“…However, as shown in Figure c, the reflection coefficient ( R ) values were much higher than the absorption coefficient ( A ) values. These results indicated that BC-GNP revealed the reflection-dominant shielding mechanism …”
Section: Resultsmentioning
confidence: 75%
“…However, as shown in Figure c, the reflection coefficient ( R ) values were much higher than the absorption coefficient ( A ) values. These results indicated that BC-GNP revealed the reflection-dominant shielding mechanism …”
Section: Resultsmentioning
confidence: 75%
“…Specifically, the evenly distributed CNT fillers can overlap each other easily due to the high aspect ratio to form 3D conductive networks, which can accelerate the electron hopping/migrating and induce eddy currents under stimulation by alternating electromagnetic fields, thus further converting microwave energy into heat by conductive loss. Moreover, apart from the overlapped CNT fillers, the interface with a small region between the adjacent CNT fillers and PI polymers can be regarded as the CNT-resin-CNT heterogeneous interfaces, and the plenty of above heterogeneous interfaces between adjacent CNT fillers can form capacitor-like structures where the accumulated and unevenly distributed free electrons at both capacitors ends effectively improve the interfacial polarization relaxation. The possessed abundant polarization sites also play an essential role in polarization loss. Eventually, the optimized porous architectures can be obtained by regulating component parameters and the CNT fillers content according to foaming kinetics, which enhances the impedance matching and improves the dielectric loss ability of PI foam. Therefore, the CNT/PI foam expresses high-efficiency MA performance with ultrabroad EAB and comparable RL min values.…”
Section: Resultsmentioning
confidence: 99%
“…Heat dissipation is becoming more and more crucial for the reliability of modern electronics and power systems. Polymers are usually used for thermal management, but their poor thermal conductivity (TC) can hardly meet the application requirement in modern electronics and power systems. Recently, thermally conductive polymer composites (TCPCs) are developed to improve the TC of polymers. Among these thermally conductive fillers, boron nitride nanosheets (BNNSs) stand out in view of their high intrinsic TC, excellent electrical insulation, and ease of synthesis. Solution or the melt blending method is widely adopted to yield the BNNS/polymer composites, in which BNNSs are randomly distributed in polymer matrices.…”
Section: Introductionmentioning
confidence: 99%