International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)
DOI: 10.1109/iedm.2001.979408
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CMP-free and CMP-less approaches for multilevel Cu/low-k BEOL integration

M.H. Tsai
1
,
S.W. Chou2,
Chih-Hsien Chang3
et al.
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