CMOS–MEMS Lateral Electrothermal Actuators

Gilgunn, Peter J.; Liu, Jingwei; Sarkar, Niladri; Fedder, Gary K.

doi:10.1109/jmems.2007.911373

Cited by 51 publications

(23 citation statements)

References 32 publications

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“…In 1925, Timoshenko [216] presented the analysis for such a structure with a constant temperature distribution. The analysis of multimorph beams experiencing strain from thermal expansion was presented in [217] and [218]. is the bending moment in the beam (internal bending moment).…”

Section: B13 Analytical Methodsmentioning

confidence: 99%

“…Finally, the moment is expressed as a function of temperature. These calculations follow the procedure outlined in [218].…”

Section: C2 Mechanical Model Of Lateral Electrothermal Actuatorsmentioning

confidence: 99%

“…The placement of the neutral axis can be calculated by taking the modulus-weighted centroid of the beam with respect to the origin: Details on the variation of the neutral axis position with the internal metal width ratio are discussed in [218]. The remainder of this discussion assumes that the neutral axis position is chosen to coincide with the boundary between different materials in the beam.…”

Section: C2 Mechanical Model Of Lateral Electrothermal Actuatorsmentioning

confidence: 99%

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Single‐Chip Scanning Probe Microscopes

Sarkar

Mansour²

2015

Micro‐ and Nanomanipulation Tools

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Scanning probe microscopes (SPMs) are the highest resolution imaging instruments available today and are among the most important tools in nanoscience. Conventional SPMs suffer from several drawbacks owing to their large and bulky construction and to the use of piezoelectric materials. Large scanners have low resonant frequencies that limit their achievable imaging bandwidth and render them susceptible to disturbance from ambient vibrations. Array approaches have been used to alleviate the bandwidth bottleneck; however as arrays are scaled upwards, the scanning speed must decline to accommodate larger payloads. In addition, the long mechanical path from the tip to the sample contributes thermal drift. Furthermore, intrinsic properties of piezoelectric materials result in creep and hysteresis, which contribute to image distortion. The tip-sample interaction signals are often measured with optical configurations that require large free-space paths, are cumbersome to align, and add to the high cost of state-of-the-art SPM systems. These shortcomings have stifled the widespread adoption of SPMs by the nanometrology community. Tiny, inexpensive, fast, stable and independent SPMs that do not incur bandwidth penalties upon array scaling would therefore be most welcome. A method to increase the quality factor (Q-factor) of flexural resonators is introduced. The method relies on an internal energy pumping mechanism that is based on the interplay between electrical, iv mechanical, and thermal effects. To the best of the author's knowledge, the devices that are designed to harness these effects possess the highest electromechanical Qs reported for flexural resonators operating in air; electrically measured Q is enhanced from ~50 to ~50,000 in one exemplary device. A physical explanation for the underlying mechanism is proposed.The design, fabrication, imaging, and tip-based lithographic patterning with the first single-chip Scanning Thermal Microscopes (SThMs) are also presented. In addition to 3 DOF scanning, these devices possess integrated, thermally isolated temperature sensors to detect heat transfer in the tip-sample region.Imaging is reported with thermocouple-based devices and patterning is reported with resistive heater/sensors. An "isothermal electrothermal scanner" is designed and fabricated, and a method to operate it is detailed. The mechanism, based on electrothermal actuation, maintains a constant temperature in a central location while positioning a payload over a range of >35μm, thereby suppressing the deleterious thermal crosstalk effects that have thus far plagued thermally actuated devices with integrated sensors.

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Section: B13 Analytical Methodsmentioning

confidence: 99%

“…Finally, the moment is expressed as a function of temperature. These calculations follow the procedure outlined in [218].…”

Section: C2 Mechanical Model Of Lateral Electrothermal Actuatorsmentioning

confidence: 99%

Section: C2 Mechanical Model Of Lateral Electrothermal Actuatorsmentioning

confidence: 99%

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Single‐Chip Scanning Probe Microscopes

Sarkar

Mansour²

2015

Micro‐ and Nanomanipulation Tools

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“…Using electrical-thermal-mechanical interaction, various techniques have been developed to actuate and control micromechanical structures and devices [1][2][3][4] and to fabricate bulk materials from micrometer-sized powders [5][6][7]. In the heart of these techniques, it is the electrothermal deformation that controls the structural stability of microscale structures and the processing performance and efficiency.…”

Section: Introductionmentioning

confidence: 99%

Electrothermal stress in conducting particulate composites

Yang

2012

J Mater Sci

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Electrothermal-mechanical interaction plays an important role in controlling the performance of electromechanical structures and field-assisted processes. The understanding of electrothermal-mechanical behavior of a material requires the analyses of Joule heating and thermomechanical deformation. In this study, we analyze the current-induced thermal stress in a conducting composite consisting of conducting spherical inclusions at dilute concentration. Assuming that there is no interaction among conducting inclusions, we obtain closed-form solutions of local temperature and thermal stress. The thermal stress created by Joule heating is proportional to the square of electric current density (electric field intensity) and the von-Mises stress reaches the maximum value at the interface between the spherical inclusion and the matrix. Large electric current will likely cause local delamination along the interface.

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“…The basic premise behind the concept of MEMS is that the efficiencies of high volume production and low unit cost achieved by the microelectronics industry over the past 50 years can be translated to devices in which the mechanical and electrical/electronic functions are integrated. In addition to the potential economic benefits, unique capabilities can be achieved by such integration to realize devices at very small scales such as sensors [1][2][3][4][5][6] , actuators 1,[7][8][9][10] , power producing devices [11][12][13] , chemical reactors [14][15][16] and biomedical devices [17][18][19][20] . The potential military applications for MEMS 21 include those in personnel systems, inertial guidance systems in precision-guided munitions, health monitoring of aircraft engine and structures, microUAVs, picosatellites, light weight radios, etc.…”

Section: Introductionmentioning

confidence: 99%

Experimental Techniques for the Measurement of Mechanical Properties of Materials Used in Microelectromechanical Systems

Kamat¹

2009

DSJ

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The knowledge of mechanical properties of materials used in microelectromechanical systems (MEMS) devices is critical not only in designing structures such as cantilevers and beams but also for ensuring their reliability during operation of these devices. It has been established that the mechanical properties are scaleand-process-dependent, and hence it is essential to measure the mechanical properties of these materials at the same length scale and using the same process as that used in their usage in MEMS devices. The various experimental techniques in vogue to measure the mechanical properties of these materials are briefly reviewed. The facilities established at the Defence Metallurgical Research Laboratory, Hyderabad, and their capabilities are also highlighted.

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CMOS–MEMS Lateral Electrothermal Actuators

Cited by 51 publications

References 32 publications

Single‐Chip Scanning Probe Microscopes

Single‐Chip Scanning Probe Microscopes

Electrothermal stress in conducting particulate composites

Experimental Techniques for the Measurement of Mechanical Properties of Materials Used in Microelectromechanical Systems

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