CMOS-Compatible Photonic Phase Shifters With Extremely Low Thermal Crosstalk Performance

De, Souvaraj; Das, Ranjan; Varshney, Ravendra K.; Schneider, Thomas

doi:10.1109/jlt.2020.3043631

Cited by 17 publications

(5 citation statements)

References 31 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Figure a displays the schematic diagram of signal crosstalk in the sensing array. Even in the sensing arrays with traditional active materials (e.g., Si, − GaN, , and InGaAs), the thermal or carriers’ diffusion-induced signal crosstalk exists. Thus, organic polyimide and Teflon with extremely low thermal diffusivity (referring to Figure b) are always adopted as interval insulants or substrates to suppress the signal crosstalk.…”

Section: Resultsmentioning

confidence: 99%

“…Such enormous thermal conductivity would dramatically reduce the thermal gradient and, subsequently, reduce the photothermal effect. Even worse, the transverse diffusion of carriers stemming from the thermal crosstalk easily leads to electrical crosstalk among the sensing pixels in an imaging array, − which always results in low imaging resolution . In this regard, the pursuit of active material that possesses high sensitivity as well as fast response speed for photothermal THz detectors is still highly desired for enhancing performance.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Direct-Laser-Writing Manipulating α/δ-FAPbI₃ Array Enables Low-Crosstalk Terahertz Sensing and Imaging

Zeng

et al. 2023

ACS Photonics

View full text Add to dashboard Cite

Terahertz (THz) sensing and imaging have received increasing interest due to their high penetration and nondestruction. The photothermal effect empowers efficient room-temperature detection of feeble THz photons without cryogenic cooling systems. Nevertheless, the inevitable transverse diffusion of phonons and charge carriers under a thermal gradient brings signal crosstalk among sensing units, hampering the realization of high-resolution THz imaging. Herein, FAPbI 3 is selected to construct a terahertz sensing array with direct-laser-writing micromanipulating α/δ-FAPbI 3 . α-FAPbI 3 possesses a sensitive THz response, while the strong electron−phonon coupling in δ-FAPbI 3 greatly suppresses the thermal and electrical crosstalk. As a result, in the THz sensing array, the crosstalk of neighbor pixels decreases from −5.35 to −17.60 dB. Moreover, the THz sensing unit exhibits a responsivity (R) of 34.3 μA W 1− , noise equivalent power of less than 5.3 × 10 −10 W Hz −1/2 , and specific detectivity (D*) of 1.4 × 10 7 Jones. The proof-of-concept imaging further confirms that our THz sensing array can significantly enhance resolution in imaging.

show abstract

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Direct-Laser-Writing Manipulating α/δ-FAPbI₃ Array Enables Low-Crosstalk Terahertz Sensing and Imaging

Zeng

et al. 2023

ACS Photonics

View full text Add to dashboard Cite

show abstract

“…Alternatively, orthogonal sampling by flat frequency combs in a modulator offers high bandwidth and an errorfree sampling for ideal devices. 14,15 Integrated optical modulators can attain very high bandwidths ranging up to 176 GHz 16 with negligible thermal crosstalk, [17][18][19][20] facilitating the sampling of signals three times its bandwidth using a three-line flat frequency comb. 21,22 Moreover, the down-conversion method does not rely on switching but rather on multiplying the signal with a sinc-pulse sequence in the time domain.…”

Section: Introductionmentioning

confidence: 99%

Comb flatness dependence for orthogonally sampled high bandwidth signals

De,

Meier,

Mandalawi

et al. 2024

Terahertz Photonics III

View full text Add to dashboard Cite

“…In this work, we simulate and analyze the impact of thermal crosstalk on a Si ring modulator and demonstrate the mitigation of this issue by a deep trench. 18 Additionally, we present how such a design improves the transmission characteristics.…”

Section: Introductionmentioning

confidence: 99%

Thermal insulation of silicon ring modulators in densely-packed photonic integrated circuits

Das

Singh

et al. 2023

Integrated Optics: Design, Devices, Systems and Applications VII

View full text Add to dashboard Cite

Increasing data rates in the wireless access require high-bandwidth signal processing, which might be problematic for electronics. One solution is provided by high-bandwidth photonic signal processing in integrated silicon photonic devices. The transformation of electrical into optical signals and sometimes the photonic signal processing itself require a modulator. Especially silicon photonic ring modulators have the potential to significantly enhance the signal processing performance for large-scale integrated photonic circuits, since they have a very low footprint and power consumption. Nevertheless, densely packed integrated photonic devices show thermal crosstalk, which may lead to problems of heat dissemination in the chips. Here we will show, that a deep trench is a suitable method to avoid this problem. We present simulation results of crosstalk mitigation for ring modulators and show the improvement in the transmission characteristics.

show abstract

CMOS-Compatible Photonic Phase Shifters With Extremely Low Thermal Crosstalk Performance

Cited by 17 publications

References 31 publications

Direct-Laser-Writing Manipulating α/δ-FAPbI₃ Array Enables Low-Crosstalk Terahertz Sensing and Imaging

Direct-Laser-Writing Manipulating α/δ-FAPbI₃ Array Enables Low-Crosstalk Terahertz Sensing and Imaging

Comb flatness dependence for orthogonally sampled high bandwidth signals

Thermal insulation of silicon ring modulators in densely-packed photonic integrated circuits

Contact Info

Product

Resources

About

CMOS-Compatible Photonic Phase Shifters With Extremely Low Thermal Crosstalk Performance

Cited by 17 publications

References 31 publications

Direct-Laser-Writing Manipulating α/δ-FAPbI3 Array Enables Low-Crosstalk Terahertz Sensing and Imaging

Direct-Laser-Writing Manipulating α/δ-FAPbI3 Array Enables Low-Crosstalk Terahertz Sensing and Imaging

Comb flatness dependence for orthogonally sampled high bandwidth signals

Thermal insulation of silicon ring modulators in densely-packed photonic integrated circuits

Contact Info

Product

Resources

About

Direct-Laser-Writing Manipulating α/δ-FAPbI₃ Array Enables Low-Crosstalk Terahertz Sensing and Imaging

Direct-Laser-Writing Manipulating α/δ-FAPbI₃ Array Enables Low-Crosstalk Terahertz Sensing and Imaging