CMOS-Based High-Density Silicon Microprobe Array for Electronic Depth Control in Neural Recording

Seidl, Karsten; Herwik, Stanislav; Nurcahyo, Y.; Torfs, Tom; Keller, M.; Schuttler, Martin; Neves, H.P.; Stieglitz, Thomas; Oliver, Paul; Ruther, Patrick

doi:10.1109/memsys.2009.4805361

Cited by 24 publications

(25 citation statements)

References 15 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The electrical performance of the probes, i.e., their recording capability and the viability of the EDC approach, was evaluated in 0.9% saline solution using the experimental setup described in detail in [26]. The setup comprises a parylene-coated tungsten wire with a diameter of 100 μm with an exposed tip serving as the stimulating probe.…”

Section: Potential Measurements In Electrolytementioning

confidence: 99%

CMOS-Based High-Density Silicon Microprobe Arrays for Electronic Depth Control in Intracortical Neural Recording–Characterization and Application

Seidl

Schwaerzle

Ulbert

et al. 2012

J. Microelectromech. Syst.

View full text Add to dashboard Cite

This paper reports on the characterization and intracortical recording performance of high-density complementary-metal-oxide-semiconductor (CMOS)-based silicon microprobe arrays. They comprise multiplexing units integrated on the probe shafts being part of the signal transmission path. Their electrical characterization reveals a negligible contribution on the electrode impedances of 139 ± 11 kΩ and 1.2 ± 0.1 MΩ and on the crosstalks of 0.12% and 0.98% for iridium oxide (IrO x ) and platinum (Pt) electrodes, respectively. The power consumption of the single-shaft probe was found to be 57.5 μW during electrode selection. The noise voltage of the switches was determined to be 5.6 nV/ √ Hz; it does not measurably affect the probe performance. The recording selectivity of the electrode array is demonstrated by electrical potential measurements in saline solution while injecting a stimulating current using an external probe. In-vivo recordings in anesthetized rats using all 188 electrodes with a pitch of 40.7 μm are presented and analyzed in terms of single neural activity and signal-to-noise ratio. The concept of electronic depth control is proven by performing mechanical translation of the probe shaft while electronically switching to adjacent electrodes to compensate the mechanical shift.[2012-0027] IndexTerms-Complementary-metal-oxide-semiconductor (CMOS) circuitry, CMOS MEMS, electrode impedances, electrode selection, high-density electrode array, neural recording, noise, potential measurements, silicon microprobes.

show abstract

Section: Potential Measurements In Electrolytementioning

confidence: 99%

CMOS-Based High-Density Silicon Microprobe Arrays for Electronic Depth Control in Intracortical Neural Recording–Characterization and Application

Seidl

Schwaerzle

Ulbert

et al. 2012

J. Microelectromech. Syst.

View full text Add to dashboard Cite

show abstract

“…These neural probes are stiff and can be inserted comparable to tungsten wire electrodes, the standard tool for electrophysiological experiments. Silicon offers the opportunity to integrate electronic circuitry, e.g., for multiplexing and amplification (Najafi and Wise 1986) but also to include electrode alignment features like mechanical (Muthuswamy et al 2005) or electronic depth control (Seidl et al 2009). In addition, microfluidic channels have been integrated for drug delivery or sampling (Wise et al 2004).…”

Section: Silicon Based Systemsmentioning

confidence: 99%

Manufacturing, assembling and packaging of miniaturized neural implants

Stieglitz

2010

Microsyst Technol

View full text Add to dashboard Cite

Implantable medical devices to interface technical aids with muscles, peripheral nerves, and the brain have been developed for many applications over the last decades. They have been investigated in fundamental neuroscientific studies and some of them have been transferred into clinical practice in diagnosis, therapy and rehabilitation, respectively. Success stories of these implants have been written with help of precision mechanics manufacturing techniques. Latest cutting edge research approaches to restore vision in blind persons and to develop an interface with the human brain as motor control interface, however, need more complex systems, larger scales of integration and higher degrees of miniaturization. Microsystems engineering offers adequate tools, methods, and materials but so far, no MEMS based active medical device has been transferred into clinical practice. Here, different designs, manufacturing technologies and packaging paradigms will be presented and assessed in close relation to the envisioned neuroscientific or medical application.

show abstract

“…The switches are controlled by a shift register formed by a chain of D-type flip-flops [3] which allows a serial programming using two control lines (data input, DIN, and clock, CLK) in combination with two lines for power supply (VSS and VDD). The probe functionality is illustrated in Fig.…”

Section: Electronics Designmentioning

confidence: 99%

“…for buffering, multiplexing, amplification, signal processing, and telemetry [2]. Further, the integration of switching units directly on the probe shaft makes it possible to realize highdensity electrode arrays for recording of single-unit activity [3]. The applied serial selection scheme of the electrodes as proposed in Ref.…”

Section: Introductionmentioning

confidence: 99%

“…This enables the localized measurement of mechanical stress along the shaft. The possible combination of switchable electrodes [3] with stress sensors of this type placed on optimal shaft positions would enable the simultaneous neural recording of brain activity via a modular design principle while taking advantage of the same selection scheme and the intrinsic switches of the stress sensors. The paper presents the novel probe design and its functionality, the CMOS-compatible processing which matches the technological approach used throughout the NeuroProbes project [1], the piezo-FET characterization and measurements demonstrating stress mapping in a brain model.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

CMOS-based high-density silicon microprobe for stress mapping in intracortical applications

Seidl

Lemke

Ramirez

et al. 2010

2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS)

View full text Add to dashboard Cite

This paper reports on a novel CMOS-based silicon microprobe for high-density intracortical stress mapping. In contrast to existing systems, square p-type field effect transistors (FET) with four source/drain contacts (piezo-FETs) are integrated on the slender, needle-like probe shaft. In total, 345 stress sensors are arranged in five columns (x/y-pitch of 51.4/26.6 µm) along the 180-µm-wide shaft. Measuring in-plane normal stress in silicon neural probes is envisioned to avoid probe fracture during insertion and to evaluate the probe deflection caused by brain motion after insertion. The combination with switchable electrodes will enable the simultaneous neural recording of brain activity. The paper presents the probe concept, the post-CMOS fabrication process, the piezo-FET characterization, and measurements demonstrating stress mapping in a brain model.

show abstract

CMOS-Based High-Density Silicon Microprobe Array for Electronic Depth Control in Neural Recording

Cited by 24 publications

References 15 publications

CMOS-Based High-Density Silicon Microprobe Arrays for Electronic Depth Control in Intracortical Neural Recording–Characterization and Application

CMOS-Based High-Density Silicon Microprobe Arrays for Electronic Depth Control in Intracortical Neural Recording–Characterization and Application

Manufacturing, assembling and packaging of miniaturized neural implants

CMOS-based high-density silicon microprobe for stress mapping in intracortical applications

Contact Info

Product

Resources

About