IECEC 96. Proceedings of the 31st Intersociety Energy Conversion Engineering Conference
DOI: 10.1109/iecec.1996.553821
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Close-spaced thermionic converters with active spacing control and heat-pipe isothermal emitters

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Cited by 9 publications
(5 citation statements)
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“…Methods to maintain microscale and nanoscale gaps by external means have included external silicon supports [ 54,55,188 ] and micro‐manipulation systems, [ 200,201 ] and active gap control has also been accomplished using piezoelectric translators. [ 83 ] Perhaps the most elegant solution, however, is to use fixed‐form inserts within the gap to define the electrode spacing. This approach has been implemented in several forms, including commercially available micron‐scale grains such as polystyrene particles, [ 202 ] alumina beads, [ 40 ] and silica spheres [ 203 ] ; through lithographically defined insulators such as silicon dioxide or zirconia columns, [ 57,60,204,205 ] quartz standoffs, [ 206 ] and photoresist pillars [ 207,208 ] ; and through freestanding structures such as corrugated ceramic films.…”
Section: Challenges and Recommendationsmentioning
confidence: 99%
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“…Methods to maintain microscale and nanoscale gaps by external means have included external silicon supports [ 54,55,188 ] and micro‐manipulation systems, [ 200,201 ] and active gap control has also been accomplished using piezoelectric translators. [ 83 ] Perhaps the most elegant solution, however, is to use fixed‐form inserts within the gap to define the electrode spacing. This approach has been implemented in several forms, including commercially available micron‐scale grains such as polystyrene particles, [ 202 ] alumina beads, [ 40 ] and silica spheres [ 203 ] ; through lithographically defined insulators such as silicon dioxide or zirconia columns, [ 57,60,204,205 ] quartz standoffs, [ 206 ] and photoresist pillars [ 207,208 ] ; and through freestanding structures such as corrugated ceramic films.…”
Section: Challenges and Recommendationsmentioning
confidence: 99%
“…The devices were able to achieve current and output power densities of A ≈ 5 − 10 Acm −2 and P ≈ 2.5 − 5 Wcm −2 , respectively. [3,[82][83][84] Experimentation with plasma-based TECs was largely discontinued after the twentieth century, due in part to the complexity of plasma engineering and the efficiency limitations of these devices that required them to be operated at very high temperatures. We refer the reader to the previous literature reviews for additional information.…”
Section: Substratementioning
confidence: 99%
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“…2). This design accommodates thermal expansion of approximately 1% that occurs at the typical operating temperatures of 1000°C -2500°C [20], [21], which avoids the complication of active control of the gap spacing [22]. We used a conformal sidewall deposition of poly-SiC to form stiff suspension legs with U-shaped cross sections, which increases the out-of-plane rigidity and avoids contact with the substrate during heating.…”
Section: A Mechanically Robust Suspended Micro-emittersmentioning
confidence: 99%
“…The work proposed by Grover [2] includes theoretical analysis and presents results of experiments carried out on stainless steel heat pipes with a wire mesh wick and sodium, lithium and silver as working fluids. As a result, these devices began to be used in applications such as in rotary heat exchanger [3], waste heat recovery systems in automobiles [4] and in hospitals [5], latent heat storage systems [6][7][8][9], energy storage in wind power systems [10], aeroponic system [11], nuclear reactor [12,13], thermionic converters [14,15], and electronics cooling applications [16]. As a result, these devices began to be used in applications such as in rotary heat exchanger [3], waste heat recovery systems in automobiles [4] and in hospitals [5], latent heat storage systems [6][7][8][9], energy storage in wind power systems [10], aeroponic system [11], nuclear reactor [12,13], thermionic converters [14,15], and electronics cooling applications [16].…”
Section: Introductionmentioning
confidence: 99%