Colloids and Surfaces A: Physicochemical and Engineering Aspect
 2024
DOI: 10.1016/j.colsurfa.2024.134428
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Cleaning mechanisms during post chemical mechanical polishing (CMP) using particle removal of surfactants via a citric acid-based solution

Haoyu Du,
Renhao Liu,
Baimei Tan
et al.
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