Classification of suppressor additives based on synergistic and antagonistic ensemble effects

Towards Structural Analysis of Polymeric Contaminants in Electrodeposited Cu films

“…3c). This is particularly disadvantageous for assessment of leveler embedment into Cu interconnects since N atoms are usually an essential component of such leveler additives (type-II suppressors [5]). In our particular case this issue becomes evident if we consider all species of the SIMS profile measured using both negative ion and MCs + modes.…”

“…To achieve super-conformal bottom-up fill of vias and trenches, the classical Damascene approach employs a three-component package, usually consisting of a so-called type-I suppressor polymer (e.g. polyalkylene glycols, PAGs) [1,[5][6][7][8][9][10][11], its specific anti-suppressor (bis-(sodium-sulfopropyl)-disulfide, SPS) and a leveler additive (type-II suppressor [5]) dissolved in the Cu(II)-rich plating bath. Particular additive mass transport effects and adsorption kinetics [12][13][14] in conjunction with geometric shape-evolution effects need to be operative during the feature fill [15][16][17][18][19] thus generating a non-uniform surface coverage of PAG suppressors and SPS anti-suppressors.…”

Combined Secondary Ion Mass Spectrometry Depth Profiling and Focused Ion Beam Analysis of Cu Films Electrodeposited under Oscillatory Conditions

“…This is how undesired over-plating (momentum plating)a fter the successful feature fill is prevented. The most important electrochemical characteristico ft his second type of suppressor additive (denoted as type-II suppressors) [4] is the absence of deactivation pathways through SPS. This feature has been identified as am echanistic prerequisite for their use as leveling reagents in the context of Damascene copper plating.…”

Investigation of adsorption behavior of smoothing additives in copper plating electrolytes

“…Its adsorption behavior was studied by stripping voltammetry. Synergistic and antagonistic interaction between the suppressor and the anions chemisorbed on the surface of copper electrodes during electrodeposition was studied in [10].…”