“…3c). This is particularly disadvantageous for assessment of leveler embedment into Cu interconnects since N atoms are usually an essential component of such leveler additives (type-II suppressors [5]). In our particular case this issue becomes evident if we consider all species of the SIMS profile measured using both negative ion and MCs + modes.…”
Section: Resultsmentioning
confidence: 99%
“…To achieve super-conformal bottom-up fill of vias and trenches, the classical Damascene approach employs a three-component package, usually consisting of a so-called type-I suppressor polymer (e.g. polyalkylene glycols, PAGs) [1,[5][6][7][8][9][10][11], its specific anti-suppressor (bis-(sodium-sulfopropyl)-disulfide, SPS) and a leveler additive (type-II suppressor [5]) dissolved in the Cu(II)-rich plating bath. Particular additive mass transport effects and adsorption kinetics [12][13][14] in conjunction with geometric shape-evolution effects need to be operative during the feature fill [15][16][17][18][19] thus generating a non-uniform surface coverage of PAG suppressors and SPS anti-suppressors.…”
ABSTRACT:The incorporation of plating additives into Cu films was studied by means of preferential inclusion and accumulation of contaminants at grain boundaries inside the Cu deposit whereas the Cu grains remain largely contamination-free. A novel LIMS desorption approach is presented which allows for a molecular structure analysis of the polymeric additive ensembles preferentially embedded at grain boundaries of the Cu deposit. Our LIMS analysis confirms a recently discussed mechanism on the action of these hybrid additives which relies on their interaction with thiolate-stabilized Cu(I) intermediates.
“…3c). This is particularly disadvantageous for assessment of leveler embedment into Cu interconnects since N atoms are usually an essential component of such leveler additives (type-II suppressors [5]). In our particular case this issue becomes evident if we consider all species of the SIMS profile measured using both negative ion and MCs + modes.…”
Section: Resultsmentioning
confidence: 99%
“…To achieve super-conformal bottom-up fill of vias and trenches, the classical Damascene approach employs a three-component package, usually consisting of a so-called type-I suppressor polymer (e.g. polyalkylene glycols, PAGs) [1,[5][6][7][8][9][10][11], its specific anti-suppressor (bis-(sodium-sulfopropyl)-disulfide, SPS) and a leveler additive (type-II suppressor [5]) dissolved in the Cu(II)-rich plating bath. Particular additive mass transport effects and adsorption kinetics [12][13][14] in conjunction with geometric shape-evolution effects need to be operative during the feature fill [15][16][17][18][19] thus generating a non-uniform surface coverage of PAG suppressors and SPS anti-suppressors.…”
ABSTRACT:The incorporation of plating additives into Cu films was studied by means of preferential inclusion and accumulation of contaminants at grain boundaries inside the Cu deposit whereas the Cu grains remain largely contamination-free. A novel LIMS desorption approach is presented which allows for a molecular structure analysis of the polymeric additive ensembles preferentially embedded at grain boundaries of the Cu deposit. Our LIMS analysis confirms a recently discussed mechanism on the action of these hybrid additives which relies on their interaction with thiolate-stabilized Cu(I) intermediates.
“…This is how undesired over-plating (momentum plating)a fter the successful feature fill is prevented. The most important electrochemical characteristico ft his second type of suppressor additive (denoted as type-II suppressors) [4] is the absence of deactivation pathways through SPS. This feature has been identified as am echanistic prerequisite for their use as leveling reagents in the context of Damascene copper plating.…”
Doctor NO: Unprecedented β‐carbon nitrosation of aliphatic tertiary amines on nitrosylruthenium complexes was revealed, where aerobic oxidative dehydrogenation of amines, CH bond activation, NC coupling, and enamine hydrolysis were involved.
“…Its adsorption behavior was studied by stripping voltammetry. Synergistic and antagonistic interaction between the suppressor and the anions chemisorbed on the surface of copper electrodes during electrodeposition was studied in [10].…”
Section: Literature Review and Problem Statementmentioning
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