Circular piezoelectric accelerometer for high band width application

In order to meet the requirements of cable fault detection, a new structure of piezoelectric accelerometer was designed and analyzed in detail. The structure was composed of a seismic mass, two sensitive beams, and two added beams. Then, simulations including the maximum stress, natural frequency, and output voltage were carried out. Moreover, comparisons with traditional structures of piezoelectric accelerometer were made. To verify which vibration mode is the dominant one on the acceleration and the space between the mass and glass, mode analysis and deflection analysis were carried out. Fabricated on an n-type single crystal silicon wafer, the sensor chips were wire-bonged to printed circuit boards (PCBs) and simply packaged for experiments. Finally, a vibration test was conducted. The results show that the proposed piezoelectric accelerometer has high sensitivity, low resonance frequency, and low transverse effect.

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“…PZT has superior piezoelectric properties compared with other piezoelectric materials [14]. Therefore, this work focuses on the use of PZT films.…”

Section: Simulation and Analysismentioning

confidence: 99%

Design of a Piezoelectric Accelerometer with High Sensitivity and Low Transverse Effect

Tian

Liu

Yang

et al. 2016

Sensors

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“…Benech et al [8] note that PVDF accelerometers are suitable for lowcost applications. The recent progress in the field of piezoelectric MEMS lead to a cost reduction of thin [9] and thick film [10] based piezoelectric accelerometers. Thus, the miniaturization of PVDF-based accelerometers as well as the integration into polymer-based lightweight compound structures becomes relevant to maintain the advantages of PVDF-based sensors.…”

Section: Introductionmentioning

confidence: 99%

Piezoelectric accelerometer based on micro injection molded polymers

Schulze

Heinrich

Wegener

et al. 2013

2013 Transducers &Amp; Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems

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A polymer-based uniaxial accelerometer with piezoelectric polyvinylidene fluoride (PVDF) copolymer transducers and micro injection molded polypropylene (PP) structures has been designed, manufactured and characterized. The mass-loaded cantilever structure shows a quasi-static charge sensitivity of 0.69 pC/g and a resonance frequency of 735 Hz. Because of its efficient processing and its small dimensions the polymer-based sensor (polySENS) can be integrated into fiber-reinforced polymer structures in order to measure low-frequency vibrations. The focus of this contribution is on the design as well as on the characterization of the polySENS to determine the sensor properties of the accelerometer due to manufacturing particularities.

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“…Microelectromechanical systems (MEMS) accelerometers have been widely used in various application fields, such as consumer electronics, automobiles, medical, structural health monitoring, and inertial navigation [1,2,3,4]. According to the displacement or force transduction mechanisms, MEMS accelerometers can be categorized as different types, including piezoelectric [5,6], capacitive [7,8], piezoresistive [9,10], tunneling [11,12], resonant [13,14,15,16], optical [17,18], thermal [19,20], and electromagnetic [21,22] accelerometers. Capacitive transduction is one of the most commonly used technologies for high-performance MEMS accelerometers since it takes advantage of simple structure, low noise, low power consumption, cost-effectiveness, and reliability [4].…”

Section: Introductionmentioning

confidence: 99%

A MEMS Micro-g Capacitive Accelerometer Based on Through-Silicon-Wafer-Etching Process

et al. 2019

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This paper presents a micromachined micro-g capacitive accelerometer with a silicon-based spring-mass sensing element. The displacement changes of the proof mass are sensed by an area-variation-based capacitive displacement transducer that is formed by the matching electrodes on both the movable proof mass die and the glass cover plate through the flip-chip packaging. In order to implement a high-performance accelerometer, several technologies are applied: the through-silicon-wafer-etching process is used to increase the weight of proof mass for lower thermal noise, connection beams are used to reduce the cross-sensitivity, and the periodic array area-variation capacitive displacement transducer is applied to increase the displacement-to-capacitance gain. The accelerometer prototype is fabricated and characterized, demonstrating a scale factor of 510 mV/g, a noise floor of 2 µg/Hz1/2 at 100 Hz, and a bias instability of 4 µg at an averaging time of 1 s. Experimental results suggest that the proposed MEMS capacitive accelerometer is promising to be used for inertial navigation, structural health monitoring, and tilt measurement applications.

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Circular piezoelectric accelerometer for high band width application

Abstract: Abstract-

Cited by 17 publications

References 8 publications

Design of a Piezoelectric Accelerometer with High Sensitivity and Low Transverse Effect

Design of a Piezoelectric Accelerometer with High Sensitivity and Low Transverse Effect

Piezoelectric accelerometer based on micro injection molded polymers

A MEMS Micro-g Capacitive Accelerometer Based on Through-Silicon-Wafer-Etching Process

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