Circuit models for three-dimensional geometries including dielectrics

Power Drive Investigation by Spectral Analysis of the Electromagnetic Field Emitted by the DC Bus

“…This last term, which is responsible for taking into account the capacitive effect, can be problematic for complex geometries [12] [13], or quite complex to implement [14]; thus, it is usually neglected in low frequencies applications modelling [15]. However, (L p , R)PEEC model yields incorrect predictions of damping or losses that occur at high frequencies or for obviously capacitive dominant systems.…”

Accurate high speed empirically based predictive modeling of deeply embedded gridded parallel plate capacitors fabricated in a multilayer LTCC process

“…The fundamental circuit used is based on the partial element equivalent circuit (PEEC) [10] which has been used extensively for interconnect analysis [11] and general 3-D high frequency structure simulation [12]. The overall building block equivalent circuits may be comprised of a combination of these with modifications to take into account building block topology and various coupling phenomena.…”

Electromagnetic modeling and signal integrity simulation of power/ground networks in high speed digital packages and printed circuit boards

“…Characterizing the lossy conductor by its surface impedance Z s , then the total electric field and surface current density J s (r) satisfy the following impedance boundary condition over the conductor surfaces: (4) Also, the surface charge q s (r), surface current J s (r), and the external current flowing into the ports of the conductors, J i , satisfy the general continuity relation: (5) Combining the boundary condition with continuity equation, we have the following set of mixed potential integral equations: (6) (7) (8) where S is the conductor surfaces and . This set of integral equations completely describes the potential, current, and charge distributions on the power and ground conductor planes.…”

“…On the other hand, due to the overwhelming complexity of digital circuit board, full-wave rigorous electromagnetic field solutions, such as those used in microwave analysis [4], become impractical for digital application because of the extremely high computational requirement, and the difficulty of integrating with time-domain circuit type simulators and design environments used by digital designers. Therefore, EM modeling and simulation methodologies that can handle large complex digital designs with reasonable accuracy and efficiency, and can provide good macro models over extended frequency bands, are very much desired and thus present a challenge to us [5][6][7][8].…”

“…On the other hand, due to the overwhelming complexity of digital circuit board, full-wave rigorous electromagnetic field solutions, such as those used in microwave analysis [4], become impractical for digital application because of the extremely high computational requirement, and the difficulty of integrating with time-domain circuit type simulators and design environments used by digital designers. Therefore, EM modeling and simulation methodologies that can handle large complex digital designs with reasonable accuracy and efficiency, and can provide good macro models over extended frequency bands, are very much desired and thus present a challenge to us [5][6][7][8].This paper presents a systematic approach which includes an efficient method for the electromagnetic modeling of packages and power/ground structures, and an integrated process for the analysis and simulation of system signal integrity and SSN effect in practical digital designs. The focus of this work is to develop a fast, flexible and accurate electromagnetic model with a clear circuit interpretation for the power/ground network, and to integrate it with active device models, transmission line networks, and chip package parasitics in a time domain co-simulation scheme.…”