2015
DOI: 10.1016/j.jallcom.2014.08.175
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Choice of the low-temperature sintering Ag paste for a-Si:H/c-Si heterojunction solar cell based on characterizing the electrical performance

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Cited by 22 publications
(13 citation statements)
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“…[ 14 ] However, for the SHJ solar cell, the Ag grid finger is obviously observed to be composed of particles or powders in Figure 2c, since the Ag particles are only bound together by the resin during the curing at about 200 °C. [ 21 ] The low‐temperature curing cannot make Ag particles coalesce together. The state that Ag electrode only adheres on the solar cell surface is also shown clearly.…”
Section: Resultsmentioning
confidence: 99%
“…[ 14 ] However, for the SHJ solar cell, the Ag grid finger is obviously observed to be composed of particles or powders in Figure 2c, since the Ag particles are only bound together by the resin during the curing at about 200 °C. [ 21 ] The low‐temperature curing cannot make Ag particles coalesce together. The state that Ag electrode only adheres on the solar cell surface is also shown clearly.…”
Section: Resultsmentioning
confidence: 99%
“…The conductive powders of the low-temperature-cured electrode are relatively dispersed, and many voids exist in the electrode bulk. A low-temperature-cured Ag paste consists of metal powders, binder resins, solvents, curing agents, and other additives [41]. Metal powders are the conductive phase, accounting for more than 90% of the paste.…”
Section: Low-temperature-cured Silver Pastementioning
confidence: 99%
“…During the curing process of low-temperature silver pastes, low-boiling-point solvents gradually burn off along with the shrinkage and cross-linking of the resin, and the diffusion of atoms on the surface of Ag nanoparticles will facilitate the connection of Ag microparticles [42,47]. Finally, a dense conductive mesh was formed by a large thermodynamic driving force provided by the resin and molten silver nanoparticles [41,47]. Therefore, the effect of the organic composition in the paste on the conductivity of the low-temperature-cured electrode is also critical.…”
Section: Low-temperature-cured Silver Pastementioning
confidence: 99%
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“…In addition, the conductive silver slurry can realize exible interconnection [8]. Because of the above excellent performance, conductive silver paste is widely used in solar cells, exible printed circuit boards, radio frequency identi cation system (RFID), electromagnetic shielding, membrane switches and other devices [9][10][11][12][13].…”
Section: Introductionmentioning
confidence: 99%