2013
DOI: 10.1007/s00542-013-2022-6
|View full text |Cite
|
Sign up to set email alerts
|

Choice of insulation materials and its effect on the performance of square microhotplate

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2017
2017
2018
2018

Publication Types

Select...
3

Relationship

0
3

Authors

Journals

citations
Cited by 3 publications
(1 citation statement)
references
References 30 publications
0
1
0
Order By: Relevance
“…Low-stress nitride (Si x N y ) or oxide/nitride/oxide (ONO) layer [ 63 , 72 , 73 , 74 ] is preferred for their low residual stress and good adhesion to metal. Except for nitride and oxide, silicon carbide is also explored as the alternative passivation material by Saxena et al [ 75 ]. A reduced thickness of the material is required to achieve similar thermal behavior, however, the nitride layer is still preferred because of the low cost and simplicity of the CMOS processes.…”
Section: Mems Microhotplatementioning
confidence: 99%
“…Low-stress nitride (Si x N y ) or oxide/nitride/oxide (ONO) layer [ 63 , 72 , 73 , 74 ] is preferred for their low residual stress and good adhesion to metal. Except for nitride and oxide, silicon carbide is also explored as the alternative passivation material by Saxena et al [ 75 ]. A reduced thickness of the material is required to achieve similar thermal behavior, however, the nitride layer is still preferred because of the low cost and simplicity of the CMOS processes.…”
Section: Mems Microhotplatementioning
confidence: 99%