2006
DOI: 10.1109/tadvp.2005.853550
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Chip-Package Codesign of Integrated Voltage-Controlled Oscillator in LCP Substrate

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Cited by 9 publications
(9 citation statements)
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“…(1), it can be concluded that an improvement in the phase noise can be expected by using higher Q passives in the resonator. Improvement in the loaded Qs can be obtained by using the cross-coupled differential oscillator [2][3][4][5][6][7] and the negative-resistance-type oscillator [8,9]. However, each of these topologies exhibit a significant amount of trade-off between the transistor transconductance and resonator size.…”
Section: Introductionmentioning
confidence: 99%
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“…(1), it can be concluded that an improvement in the phase noise can be expected by using higher Q passives in the resonator. Improvement in the loaded Qs can be obtained by using the cross-coupled differential oscillator [2][3][4][5][6][7] and the negative-resistance-type oscillator [8,9]. However, each of these topologies exhibit a significant amount of trade-off between the transistor transconductance and resonator size.…”
Section: Introductionmentioning
confidence: 99%
“…By selecting an inductor of the smallest size, the phase-noise requirements might be satisfied, but the startup conditions may be violated [2,3]. Additionally, in [9] it was shown that the phase noise of a low-power oscillator shows high sensitivity to variations in the resonator Q. Hence, the manufacturing (processing) variations across the total processing area may cause the phase noise to differ for oscillators of the same batch; even though the oscillator startup conditions are satisfied.…”
Section: Introductionmentioning
confidence: 99%
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