Chip/Package/Board Co-Design Methodology Applied to Full-Custom Heterogeneous Integration

Brandtner, Thomas; Pressel, K.; Floman, Natalia; Schultz, Michael; Vogl, M.

doi:10.1109/ectc32862.2020.00269

Cited by 2 publications

(1 citation statement)

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“…As a result, successful development of heterogeneous integrated systems relies on a complex and seamless design methodology, including 2.5-/3-D electromagnetic (EM), thermal, and thermomechanical FEM design. Significant effort has been spent in the field of heterogeneous design methodology [199], [200], but more work still lies ahead to unleash the full potential of heterogeneously integrated systems.…”

Section: Heterogeneous Integrationmentioning

confidence: 99%

Millimeter-Wave and Terahertz Transceivers in SiGe BiCMOS Technologies

Kissinger

Kahmen

Weigel

2021

IEEE Trans. Microwave Theory Techn.

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This invited paper reviews the progress of silicon-germanium (SiGe) bipolar-complementary metal-oxidesemiconductor (BiCMOS) technology-based integrated circuits (ICs) during the last two decades. Focus is set on various transceiver (TRX) realizations in the millimeter-wave range from 60 GHz and at terahertz (THz) frequencies above 300 GHz. This article discusses the development of SiGe technologies and ICs with the latter focusing on the commercially most important applications of radar and beyond 5G wireless communications. A variety of examples ranging from 77-GHz automotive radar to THz sensing as well as the beginnings of 60-GHz wireless communication up to THz chipsets for 100-Gb/s data transmission are recapitulated. This article closes with an outlook on emerging fields of research for future advancement of SiGe TRX performance.

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Section: Heterogeneous Integrationmentioning

confidence: 99%