Chip-on-Flex Packaging of Optoelectronic Devices in Polymer-Based Planar Optical Interconnects

Wang, Yixiao; Overmeyer, Ludger

doi:10.1109/jstqe.2018.2827674

IEEE J. Select. Topics Quantum Electron.

2018

DOI: 10.1109/jstqe.2018.2827674

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Chip-on-Flex Packaging of Optoelectronic Devices in Polymer-Based Planar Optical Interconnects

Yixiao Wang

Ludger Overmeyer

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2020

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Chip-on-Flex Packaging of Optoelectronic Devices in Polymer-Based Planar Optical Interconnects

Cited by 1 publication

References 14 publications

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