Chip Demonstration of a High-Density (43Gb) and High-Search-Bandwidth (300Gb/s) 3D NAND Based In-Memory Search Accelerator for Ternary Content Addressable Memory (TCAM) and Proximity Search of Hamming Distance

Hsieh, Chih-Chang; Lue, Hang-Ting; Li, Yung-Chun; Hung, Shuo-Nan; Hung, Chun-Hsiung; Wang, Keh-Chung; Lu, Chih‐Yuan

doi:10.23919/vlsitechnologyandcir57934.2023.10185361

2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) 2023

DOI: 10.23919/vlsitechnologyandcir57934.2023.10185361

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Chip Demonstration of a High-Density (43Gb) and High-Search-Bandwidth (300Gb/s) 3D NAND Based In-Memory Search Accelerator for Ternary Content Addressable Memory (TCAM) and Proximity Search of Hamming Distance

Chih-Chang Hsieh

Hang-Ting Lue

Yung-Chun Li

et al.

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Flash-based Computing-in-memory Architectures with High-accuracy and Robust Reliabilities for General-purpose Applications

Feng,

Qi,

Zhan

et al. 2023

2023 IEEE 15th International Conference on ASIC (ASICON)

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Flash-based Computing-in-memory Architectures with High-accuracy and Robust Reliabilities for General-purpose Applications

Feng,

Qi,

Zhan

et al. 2023

2023 IEEE 15th International Conference on ASIC (ASICON)

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Chip Demonstration of a High-Density (43Gb) and High-Search-Bandwidth (300Gb/s) 3D NAND Based In-Memory Search Accelerator for Ternary Content Addressable Memory (TCAM) and Proximity Search of Hamming Distance

Cited by 1 publication

References 0 publications

Flash-based Computing-in-memory Architectures with High-accuracy and Robust Reliabilities for General-purpose Applications

Flash-based Computing-in-memory Architectures with High-accuracy and Robust Reliabilities for General-purpose Applications

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