Encapsulated printed circuit boards typically use conventional thermosetting polymers which are difficult to remove without damaging the electronics if upgrades are needed. To improve the efficiency of maintaining printed circuit boards, network polymers with thermally reversible linkages were developed to provide an alternative class of encapsulation thermosets that could be easily and non-destructively removed and later reapplied. These polymers include functionalities that dynamically break and form covalent bonds. Over time, the connectivity of the network evolves, which causes the macroscopic stress in the material to relax and the permanent shape to change even if these processes are in equilibrium. With respect to removal, the equilibrium behavior of these processes changes if the thermodynamic state of the material is changed, which alters the number density of chains. If the number density of chains is reduced below the percolation threshold, the material exhibits a gel-point transition beyond which, it behaves as a viscous liquid. These two properties contrast sharply with conventional thermosetting polymers, which do not exhibit this relaxation mechanism nor a gel-point transition.To take advantage of such novel material capabilities at length scales relevant to electronics packaging, a continuum-scale constitutive model is needed that correctly accounts for the thermalchemical-viscoelastic behavior of such materials, especially since the state of the art for using 3 them is limited to experimental investigations. To meet this need, a continuum-scale, thermodynamically consistent free energy description of such materials is developed in this work. Paired with this free energy are non-equilibrium contributions associated with the topological rearrangement of the network as chains are added and removed as well as viscoelasticity. The model is calibrated and validated against experimental data published in the literature. Finally, simple encapsulation thermal-mechanical scenarios are examined that demonstrate a substantial difference in behavior between conventional polymer networks vs. those with thermally reversible linkages.4 Acknowledgment