“…For device application the grown crystals needs to be sliced and polished with good surface roughness, sometimes even ~1 nm [31]. Hence the utilisation of LN in high-performance devices requires that the grown single crystals have to be subjected to various machining processes including wire saw slicing from an ingot, mechanical polishing or lapping and chemical polishing, to produce a wafer free from cracks and subsurface damage [32,33,34].…”