2018
DOI: 10.3762/bjnano.9.124
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Chemistry for electron-induced nanofabrication

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Cited by 9 publications
(11 citation statements)
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“…Focused electron beam induced deposition (FEBID) is a direct-write technique to fabricate nanostructures by decomposing suitable precursor molecules under the well-focused high-energy electron beam of an electron microscope. For FEBID of metallic structures, organometallic precursors are employed. These must fulfill several requirements, the most important being (i) sufficient volatility to allow dosing of the precursor via the gas phase and (ii) low stability under electron exposure to enable complete removal of the organic components of the precursor.…”
Section: Introductionmentioning
confidence: 99%
“…Focused electron beam induced deposition (FEBID) is a direct-write technique to fabricate nanostructures by decomposing suitable precursor molecules under the well-focused high-energy electron beam of an electron microscope. For FEBID of metallic structures, organometallic precursors are employed. These must fulfill several requirements, the most important being (i) sufficient volatility to allow dosing of the precursor via the gas phase and (ii) low stability under electron exposure to enable complete removal of the organic components of the precursor.…”
Section: Introductionmentioning
confidence: 99%
“…The situation is different for beam-assisted deposition techniques where precursor molecules (often metal-containing) are introduced to the vicinity of a substrate by a gas-injection system. Although the possible role of secondary electrons in the deposition process has recently inspired a large number of studies on low-energy electron interactions with deposition precursors, there are practically no data concerning the interaction of these precursors with primary ions. The spread of secondary electrons interacting with precursor molecules during the focused ion beam-induced deposition (FIBID) is low, increasing the relative importance of precursor decomposition by primary ions, as studied in the present work.…”
Section: Introductionmentioning
confidence: 99%
“…However, the underlying physics and chemistry of the repair process is considerably complex. On a fundamental level, we identify three main contributions: the size of the electron affected area of the mask, [22][23][24][25][26] the properties of the precursor molecules in general 20 and particularly the mask material, 22,23,25 and finally the instrumental setup. Furthermore, each of the listed contributors can be broken down in several subtopics all influencing the achievable resolution.…”
Section: Epe and Minimum Repair Size-what Is Limiting Resolutionmentioning
confidence: 99%
“…[16][17][18][19] The basic principle of FEBIP is the very local alteration of adsorbed precursor molecules or/and the substrate by the impact of electrons. 17,20 More specifically, focused electron-beam induced etching (FEBIE) 15,16 is used as a subtractive and focused electron-beam induced deposition (FEBID) 18,19,21 as an additive technique. To do so, the focused e-beam is applied in the presence of certain precursor molecules thus triggering the local removal (FEBIE) or deposition (FEBID) of material.…”
Section: Introductionmentioning
confidence: 99%