ChemInform Abstract: Microstructural Design of New High Conductivity — High Strength Cu‐Based Alloy.

Abstract

%, 8.1 at.%, 23.1 at.%) are investigated. The materials exhibit an excellent balance between strength and electrical conductivity properties. An increase of Mg content modifies microstructural features and leads to a strong increase of strength (more than 1000 MPa) without any significant deterioration of the conductivity. This behavior is attributed to the formation of eutectic islands in which high density of Cu 2Mg nanoparticles precipitate during cooling. The Cu-Mg material is a good alternative to the Cu-Be system which has the disadvantage of toxicity. -(GORSSE*, S.; OUVRARD, B.; GOUNE, M.; POULON-QUINTIN, A.; J. Alloys Compd. 633 (2015) 42-47, http://dx.