Chemical Vapor Deposition of Silicon Dioxide Films

Foggiato, J.

doi:10.1016/b978-081551442-8.50008-0

Cited by 20 publications

(17 citation statements)

References 10 publications

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“…The high conductivity of metals allows for ultrathin metal cores (down to <1 m), with an adjustable insulating layer from <1 to >50 m thick. In typical preparations, the bare metal wire was wrapped around an open 10-cm spindle, followed by depositing a glass insulating layer ~1 m thick using silane decomposition in a Thermco lowtemperature oxide furnace at 300°C, providing a robust inorganic insulating layer (26).…”

Section: Microwire Bundlesmentioning

confidence: 99%

Massively parallel microwire arrays integrated with CMOS chips for neural recording

et al. 2020

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Multi-channel electrical recordings of neural activity in the brain is an increasingly powerful method revealing new aspects of neural communication, computation, and prosthetics. However, while planar silicon-based CMOS devices in conventional electronics scale rapidly, neural interface devices have not kept pace. Here, we present a new strategy to interface silicon-based chips with three-dimensional microwire arrays, providing the link between rapidly-developing electronics and high density neural interfaces. The system consists of a bundle of microwires mated to large-scale microelectrode arrays, such as camera chips. This system has excellent recording performance, demonstrated via single unit and local-field potential recordings in isolated retina and in the motor cortex or striatum of awake moving mice. The modular design enables a variety of microwire types and sizes to be integrated with different types of pixel arrays, connecting the rapid progress of commercial multiplexing, digitisation and data acquisition hardware together with a three-dimensional neural interface.

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Section: Microwire Bundlesmentioning

confidence: 99%

Massively parallel microwire arrays integrated with CMOS chips for neural recording

et al. 2020

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“…Sharpening the probe tip geometry is a common strategy for reducing tissue compression in penetrating microelectrodes 26,27 which may result in less tissue damage, such as for Michigan-style probe arrays 28,29 . To elucidate the effects of probe shape in the 10-100 µm range, penetration of angle-polished (24º) and electrosharpened probes (tip radius ~10 nm, (ex vivo shown in Figure S3).…”

Section: Tip Geometry Dependencementioning

confidence: 99%

Ultra-sensitive measurement of brain penetration mechanics and blood vessel rupture with microscale probes

Obaid

Hanna

et al. 2020

Preprint

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Microscale electrodes, on the order of 10-100 μm, are rapidly becoming critical tools for neuroscience and brain-machine interfaces (BMIs) for their high channel counts and spatial resolution, yet the mechanical details of how probes at this scale insert into brain tissue are largely unknown. Here, we performed quantitative measurements of the force and compression mechanics together with real-time microscopy for in vivo insertion of a systematic series of microelectrode probes as a function of diameter (7.5-100 μm and rectangular Neuropixels) and tip geometry (flat, angled, and electrochemically sharpened). Results elucidated the role of tip geometry, surface forces, and mechanical scaling with diameter. Surprisingly, the insertion force post-pia penetration was constant with distance and did not depend on tip shape. Real-time microscopy revealed that at small enough lengthscales (<25 μm), blood vessel rupture and bleeding during implantation could be entirely avoided. This appears to occur via vessel displacement, avoiding capture on the probe surface which led to elongation and tearing for larger probes. We propose a new, three-zone model to account for the probe size dependence of bleeding, and provide mechanistic guidance for probe design.

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“…Despite their high potential, the applicability of the existing technologies is limited due to the high processing cost of CVD processes, which require a reactor and vacuum equipment [20], or the inherently porous nature of sol-gel SiO 2 , which requires high temperature sintering (> 600 ºC) to reach fully densified ceramic films [21]. As a viable alternative to the traditional processes, the deposition of SiO 2 -like films from hydrogen silsesquioxane (HSQ) precursor has been demonstrated [22][23][24].…”

Section: Introductionmentioning

confidence: 99%

Corrosion resistance of AISI 316L coated with an air-cured hydrogen silsesquioxane based spin-on-glass enamel in chloride environment

Lampert

Christiansen²,

Din

et al. 2017

Corrosion Science

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The efficiency of thin hydrogen silsesquioxane (HSQ)-based corrosion barrier coatings on 316L substrates after oxidative thermal curing at 400-550 ºC in air was investigated. Infrared spectroscopy and electrochemical impedance spectroscopy showed that an increasing curing temperature leads to progressing coating densification, accompanied by decreasing barrier properties. Cyclic polarization measurements indicated that defects due to substrate oxidation are detrimental for the substrate passivity. Insufficiently polymerized coatings showed poor chemical stability in neutral salt spray testing and the chemical coating stability increased with curing temperature. Oxidative curing was found inadequate as polymerization treatment of HSQbased corrosion barrier coatings on 316L substrate.

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Chemical Vapor Deposition of Silicon Dioxide Films

Cited by 20 publications

References 10 publications

Massively parallel microwire arrays integrated with CMOS chips for neural recording

Massively parallel microwire arrays integrated with CMOS chips for neural recording

Ultra-sensitive measurement of brain penetration mechanics and blood vessel rupture with microscale probes

Corrosion resistance of AISI 316L coated with an air-cured hydrogen silsesquioxane based spin-on-glass enamel in chloride environment

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