2014
DOI: 10.1002/cite.201400045
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Chemical Resistance and Mechanical Stability of Polymer Film Heat Exchangers

Abstract: Polyimide and polytetrafluoroethylene (PTFE) films were examined as alternative materials in heat exchangers in respect of their mechanical behavior at temperatures of up to 90°C and in contact with water, toluene and hexane. It was shown that the PTFE films have a sufficient durability and can be successfully used with these organic liquids. Furthermore, a hydrodynamically optimized prototype of a heat exchanger was designed based on CFD studies coupled with FEM analysis considering geometry deformations of t… Show more

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Cited by 10 publications
(5 citation statements)
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“…Polymeric materials have been widely used in industry because of their low cost and excellent properties, including high strength-to-weight ratio, chemical stability, and corrosion resistance. High thermal conductivity ( k ) can significantly improve polymers’ capability of heat dissipation, tolerance to thermal impulse, and so on. Highly thermal conductive polymers are very sought after for applications in thermal design of flexible electronics as the substrate for excellent heat dissipation, apparel of reduced heat stress to quickly respread the accumulated heat from sensitive body areas, and to conduct the heat to the environment, and as fillers to make high-performance material interfaces used in central processing unit cooling.…”
Section: Introductionmentioning
confidence: 99%
“…Polymeric materials have been widely used in industry because of their low cost and excellent properties, including high strength-to-weight ratio, chemical stability, and corrosion resistance. High thermal conductivity ( k ) can significantly improve polymers’ capability of heat dissipation, tolerance to thermal impulse, and so on. Highly thermal conductive polymers are very sought after for applications in thermal design of flexible electronics as the substrate for excellent heat dissipation, apparel of reduced heat stress to quickly respread the accumulated heat from sensitive body areas, and to conduct the heat to the environment, and as fillers to make high-performance material interfaces used in central processing unit cooling.…”
Section: Introductionmentioning
confidence: 99%
“…Typical polymers are well-documented to have a low thermal conductivity ( k ) in the order of 0.1 W/(m·K) . Polymers with a high k have been promising candidates for industrial applications combining with their other characteristics such as mechanical flexibility, high corrosion resistance, lighter weight, and chemical stability. Examples of applications include solar hot-water collectors, heat exchangers, electronic packaging, membranes, microelectronic devices and nanocomposites, gas sensors, field-effect transistors, and other fields . Even though bulk polymers have a low k , the polymers can be manipulated and improved via structure engineering and tailoring to achieve relatively high k .…”
Section: Introductionmentioning
confidence: 99%
“…Additionally, polymers typically have a certain degree of gas permeability and a low thermal conductivity. 3D‐printing of polymeric materials as reactors is already established in special fields of reaction engineering [7] and also in the application of polymers for process equipment [8]. The combination of ISRU and 3D‐printing was already discussed as early as 2012 [9].…”
Section: Introductionmentioning
confidence: 99%