Chemical mechanical polishing for copper films in integrated circuit wiring layers using an advanced slurry

Liu, Jianghao; Niu, Xinhuan; Jia, Yingqian; Zhan, Ni; Zou, Yida; Shi, Yunhui; Zhou, Jianwei

doi:10.1016/j.triboint.2024.109832

Tribology International

2024

DOI: 10.1016/j.triboint.2024.109832

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Chemical mechanical polishing for copper films in integrated circuit wiring layers using an advanced slurry

Jianghao Liu,

Xinhuan Niu,

Yingqian Jia

et al.

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Chemical mechanical polishing for copper films in integrated circuit wiring layers using an advanced slurry

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References 55 publications

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